LTM2894
Isolated USB Data
Transceiver
FEATURES DESCRIPTION
n
Isolated USB Transceiver: 7500V for 1 Minute The LTM 2894 is a complete galvanically-isolated USB 2.0
RMS
n
CSA (IEC/UL) Approved, File #255632 compatible Module (micromodule) transceiver.
n
Reinforced Insulation
The LTM2894 is ideal for isolation in host, hub, bus split-
n
USB 2.0 Full Speed and Low Speed Compatible
ter or peripheral device applications. It is compatible with
n
Auto-Configuration of Bus Speed
USB 2.0 full speed (12Mbps) and low speed (1.5Mbps)
n
4.4V to 36V V and V Operating Range
BUS BUS2
operation. Automatic speed selection configures integrated
n
3.3V LDO Output Supply Signal References V and
LO
pull-up resistors on the upstream port to match those
V
LO2
sensed on the downstream device.
n
50kV/s Common Mode Transient Immunity
n The isolator Module technology uses coupled inductors
20kV HBM ESD on USB Interface Pins
n to provide 7500V of isolation and 17.4mm of creepage
1414V Maximum Continuous Working Voltage RMS
PEAK
n between the upstream and downstream USB interface.
17.4mm Creepage Distance
n This device is ideal for systems requiring isolated ground
22mm 6.25mm Surface Mount BGA
returns or large common mode voltage variations. Uninter-
rupted communication is guaranteed for common mode
APPLICATIONS
transients greater than 50kV/s.
n
Isolated USB Interfaces
Enhanced ESD protection allows this part to withstand
n
Host, Hub, or Device Isolation
up to 20kV (human body model) on the USB transceiver
n
Industrial/Medical Data Acquisition
interface pins to local supplies and 20kV through the
isolation barrier to supplies without latchup or damage.
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TYPICAL APPLICATION
Isolated V2.0 Full Speed Hub Port
5V
ISO
Full Speed Data
5V
3.3V
+
D2
V V
LTM2894
BUS BUS2
0.5V/DIV
V V
LO2
LO
ON ON2
120F
+ +
D1 D2
HUB
C
USB PORT
D2
0.5V/DIV
D1 D2
2894 TA01b
500ns/DIV
15k 15k
GND GND2
2894 TA01
Rev A
1
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ISOLATION BARRIERLTM2894
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION
(Note 1)
TOP VIEW
Supply Voltages
1 2 3 4 5 6
V to GND .......................................... 0.3V to 45V +
BUS
D1 D1 ON V GND V
LO BUS
A
V to GND2 ...................................... 0.3V to 45V
BUS2
B
V to GND .................................................. 0.3V to 4V
LO
GND
C
V to GND2 ............................................... 0.3V to 4V
LO2
D
ON to GND ...................................... 0.3V to (V + 0.3)
LO
E
ON2 to GND2 ................................ 0.3V to (V + 0.3)
LO2
+
F
D1 , D1 to GND ....................................... 0.3V to 5.3V
+
G
D2 , D2 to GND2 .................................... 0.3V to 5.3V
H
Operating Temperature Range
J
LTM2894C (Notes 1, 3) ................................ 0 to 70C
K
LTM2894I (Notes 1, 3) .............................40 to 85C
L
LTM2894H (Notes 1, 3) ......................... 40 to 125C
M
Storage Temperature Range ...................... 40 to 125C
N
Maximum Internal Operating Temperature ............ 125C
P
Lead Temperature (Soldering, 10 sec) ...................260C
R
S
T
U
V
GND2
W
X
+
D2 D2 ON2 V V
LO2 BUS2
GND2
BGA PACKAGE
24-LEAD (22mm 6.25mm 2.06mm)
T = 125C, = 49.6C/W, = 33.7C/W, = 26CW, = 34C/W,
JMAX JA JB JCTOP JCBOT
WEIGHT = 0.5g
ORDER INFORMATION
PART MARKING
PACKAGE MSL
PART NUMBER TYPE BALL FINISH DEVICE FINISH CODE RATING TEMPERATURE RANGE
LTM2894CY#PBF 0C to 70C
LTM2894IY#PBF BGA SAC305 (RoHS) LTM2894Y e1 3 40C to 85C
LTM2894HY#PBF 40C to 125C
Device temperature grade is indicated by a label on the shipping container. This product is not recommended for second side reflow.
This product is moisture sensitive. For more information, go to
Pad or ball finish code is per IPC/JEDEC J-STD-609.
Recommended BGA PCB Assembly and Manufacturing Procedures.
BGA Package and Tray Drawings
Rev A
2
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