SMD291SNL60T4 SMD291SNL60T4 Datasheet revision 1.1 www.chipquik.com Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 60g T4 Mesh Two Part Mix PATENT PENDING Product Highlights 2 year shelf life unrefrigerated before mixed Low voiding Printing speeds up to 100mm/sec Excellent wetting compatibility on most board finishes Long stencil life Passes BONO test 1.56% Wide process window RoHS II and REACH compliant Clear residue Specifications Alloy: Sn96.5/Ag3.0/Cu0.5 Mesh Size: T4 Micron (m) Range: 20-38 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Load: 87% Metal by Weight Melting Point: 217-220C (423-428F) Packaging: 2 compartment bag, includes Jar for after mixed storage, 60g Shelf Life: Before Mixed: Refrigerated >24 months, Unrefrigerated >24 months After Mixed: Refrigerated >6 months, Unrefrigerated >2 months How to Mix the Two Parts This product MUST BE MIXED within its bag before use. To mix, squeeze the flux pocket towards the solder powder pocket and the seal between the two compartments will break open, creating a single pocket bag. Then knead the mixture back and forth for 2-3 minutes, or until a uniform consistency is achieved. Printer Operation Print Speed: 25-100mm/sec Squeegee Pressure: 70-250g/cm of blade Under Stencil Wipe: Once every 10-25 prints, or as necessary Stencil Life >8 hours 20-50% RH 22-28C (72-82F) >4 hours 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Before Mixed: Store refrigerated or at room temperature 3-25C (37-77F). Do not freeze. After Mixed: Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Once mixed, the solder paste can be dispensed by cutting a small corner off the bag. It can be resealed with a piece of Scotch tape, or it can be stored by dispensing the entire bag into the provided empty jar. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this products stated shelf life. 1 1994-2017 Chip Quik Inc. Recommended Profile Reflow profile for Sn96.5/Ag3.0/Cu0.5 solder assembly, designed as a starting point for process optimization. 249C (480F) 217C (423F) 175C (347F) Temperature 150C (302F) 25C (77F) 0sec 90sec 180sec 210sec 240sec 270sec Time Test Results Test J-STD-004 or other Test Requirement Result requirements as stated Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5% Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean) Surface Insulation Resistance 85C, IPC-TM-650: 2.6.3.7 L: 100M (No-clean) 85% RH 168 Hours Tack Value IPC-TM-650: 2.4.44 64g Viscosity Malcom 10 RPM/25C IPC-TM-650: 2.4.34.4 Print: 155-215, Dispense: 125-170 3 (x10 mPa/s) Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Compliant Coalition (EICC) REACH Compliance Articles 33 and 67 of Regulation (EC) Contains no substance >0.1% w/w that No 1907/2006 is listed as a SVHC or restricted for use in solder materials Conforms to the following Industry Standards: J-STD-004B, Amendment 1 (Solder Fluxes): Yes J-STD-005A (Solder Pastes): Yes J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes RoHS 2 Directive 2011/65/EU: Yes 2 1994-2017 Chip Quik Inc.