X-On Electronics has gained recognition as a prominent supplier of GA50JT12-247 jfet across the USA, India, Europe, Australia, and various other global locations. GA50JT12-247 jfet are a product manufactured by GeneSiC Semiconductor. We provide cost-effective solutions for jfet, ensuring timely deliveries around the world.

GA50JT12-247 GeneSiC Semiconductor

GA50JT12-247 electronic component of GeneSiC Semiconductor
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Part No.GA50JT12-247
Manufacturer: GeneSiC Semiconductor
Category:JFET
Description: 1200 V 100A (Tc) 583W (Tc) Through Hole TO-247AB
Datasheet: GA50JT12-247 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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3000 : USD 116.414
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GA50JT12-247 Normally OFF Silicon Carbide V = 1200 V DS Junction Transistor R = 20 m DS(ON) I = 100 A D (Tc = 25C) I = 50 A D (Tc > 125C) h = 85 FE (Tc = 25C) Features Package 175 C Maximum Operating Temperature Gate Oxide Free SiC Switch D Exceptional Safe Operating Area Excellent Gain Linearity Temperature Independent Switching Performance Low Output Capacitance S Positive Temperature Coefficient of R DS,ON D G Suitable for Connecting an Anti-parallel Diode TO-247 Advantages Applications Compatible with Si MOSFET/IGBT Gate Drive ICs Down Hole Oil Drilling, Geothermal Instrumentation > 20 s Short-Circuit Withstand Capability Hybrid Electric Vehicles (HEV) Lowest-in-class Conduction Losses Solar Inverters High Circuit Efficiency Switched-Mode Power Supply (SMPS) Minimal Input Signal Distortion Power Factor Correction (PFC) High Amplifier Bandwidth Induction Heating Uninterruptible Power Supply (UPS) Motor Drives Table of Contents Section I: Absolute Maximum Ratings .......................................................................................................... 1 Section II: Static Electrical Characteristics ................................................................................................... 2 Section III: Dynamic Electrical Characteristics ............................................................................................ 2 Section IV: Figures .......................................................................................................................................... 3 Section V: Driving the GA50JT12-247 ........................................................................................................... 7 Section VI: Package Dimensions ................................................................................................................. 11 Section VII: SPICE Model Parameters ......................................................................................................... 12 Section I: Absolute Maximum Ratings Parameter Symbol Conditions Value Unit Notes V = 0 V Drain Source Voltage V GS 1200 V DS Continuous Drain Current I T = 25C 100 A Fig. 17 D C Continuous Drain Current I T = 145C 50 A Fig. 17 D C Continuous Gate Current I 3.5 A G o T = 175 C, I = 50 VJ D,max Turn-Off Safe Operating Area RBSOA A Fig. 19 Clamped Inductive Load V V DS DSmax o T = 175 C, I = 1 A, V = 800 V, VJ G DS Short Circuit Safe Operating Area SCSOA >20 s Non Repetitive Reverse Gate Source Voltage V 30 V SG Reverse Drain Source Voltage V 25 V SD T = 25 C / 145 C, t > 100 ms Power Dissipation P 583 / 116 W Fig. 16 tot C p Storage Temperature T -55 to 175 C stg Dec 2015 Latest version of this datasheet at: GA50JT12-247 Section II: Static Electrical Characteristics Value Parameter Symbol Conditions Unit Notes Min. Typical Max. A: On State 20 I = 50 A, T = 25 C D j Drain Source On Resistance R I = 50 A, T = 150 C 30 m Fig. 5 DS(ON) D j I = 50 A, T = 175 C D j 35 I = 50 A, I /I = 40, T = 25 C 3.42 D D G j Gate Source Saturation Voltage V V Fig. 7 GS,SAT I = 50 A, I /I = 30, T = 175 C D D G j 3.23 85 V = 8 V, I = 50 A, T = 25 C DS D j DC Current Gain h V = 8 V, I = 50 A, T = 125 C 57 Fig. 4 FE DS D j V = 8 V, I = 50 A, T = 175 C DS D j 51 B: Off State 10 V = 1200 V, V = 0 V, T = 25 C DS GS j Drain Leakage Current I V = 1200 V, V = 0 V, T = 150 C 20 A Fig. 8 DSS DS GS j V = 1200 V, V = 0 V, T = 175 C DS GS j 20 Gate Leakage Current I V = 20 V, T = 25 C 20 nA SG SG j C: Thermal Thermal resistance, junction - case R 0.26 C/W Fig. 20 thJC Section III: Dynamic Electrical Characteristics Value Parameter Symbol Conditions Unit Notes Min. Typical Max. A: Capacitance and Gate Charge Input Capacitance C V = 0 V, V = 800 V, f = 1 MHz 7080 pF Fig. 9 iss GS DS Reverse Transfer/Output Capacitance C /C V = 800 V, f = 1 MHz 130 pF Fig. 9 rss oss DS Output Capacitance Stored Energy E V = 0 V, V = 800 V, f = 1 MHz 50 J Fig. 10 OSS GS DS Effective Output Capacitance, C I = constant, V = 0 V, V = 0800 V 230 pF oss,tr D GS DS time related Effective Output Capacitance, C V = 0 V, V = 0800 V 160 pF oss,er GS DS energy related V = -53 V Gate-Source Charge Q GS 60 nC GS Gate-Drain Charge Q V = 0 V, V = 0800 V 185 nC GD GS DS Gate Charge - Total Q 245 nC G 1 B: Switching Internal Gate Resistance ON R V > 2.5 V, V = 0 V, T = 175 C 0.1 G(INT-ON) GS DS j Turn On Delay Time t 15 ns d(on) T = 25 C, V = 800 V, j DS Fall Time, V t I = 50 A, Resistive Load 35 ns Fig. 11, 13 DS f D Refer to Section V for additional Turn Off Delay Time t 35 ns d(off) driving information. Rise Time, V t 20 ns Fig. 12, 14 DS r Turn On Delay Time t 15 ns d(on) Fall Time, V t 35 ns Fig. 11 DS f T = 175 C, V = 800 V, j DS I = 50 A, Resistive Load Turn Off Delay Time t D 40 ns d(off) Rise Time, V t 20 ns Fig. 12 DS r Turn-On Energy Per Pulse E 1070 J Fig. 11, 13 on T = 25 C, V = 800 V, j DS I = 50 A, Inductive Load 360 Turn-Off Energy Per Pulse E D J Fig. 12, 14 off Refer to Section V. Total Switching Energy E 1430 J tot Turn-On Energy Per Pulse E 1030 J Fig. 11 on T = 175 C, V = 800 V, j DS Turn-Off Energy Per Pulse E 320 J Fig. 12 off I = 50 A, Inductive Load D Total Switching Energy E 1350 J tot 1 All times are relative to the Drain-Source Voltage V DS Dec 2015 Latest version of this datasheet at:

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8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
GENESIC SEMI
GENESIC SEMICONDUCTOR INC.

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