ISP130301 (1) High Performance Bluetooth V4.2 & ANT Low Energy Module with MCU and Antenna This tiny LGA module, 8 x 11 x 1.2 mm, is based on the nRF51 series Chip. Its powerful Cortex M0 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. All chip digital and analogue interfaces are available and give optimum capabilities for sensor integration. Key Features Applications Single Mode BLE V4.2 Compliant Connected sensors for medical devices, healthcare, sport, fitness, industrial (1) ANT+ protocol in option IoT applications, connected objects IPv6 Connectivity Wearable technology ECDH Encryption Home automation Based on Nordic Semiconductor nRF51 Beacons 2.4GHz low energy RF Transceiver 32bit ARM Cortex M0 CPU 256 kB Flash 16 kB or 32 kB SRAM in option 30 GPIOs including 6 ADC inputs and / or Certifications 2 ADC reference Ultra Low Power Consumption Bluetooth SIG certified QDL listing Single 1.8 to 3.6 V supply Fully CE certified module Very small size 8.0 x 11.0 x 1.2 mm Fully FCC certified module Temperature -40 to +85 C Fully IC certified module Fully integrated RF matching and Antenna Fully IMOC certified module Integrated 16 MHz Clock Fully TELEC certified module Integrated 32.768 kHz Synchronization RoHS compliant DC-DC loading circuit fully integrated January 16, 2017 Document Ref: isp ble DS130301 R13.docx Page 1/24 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. BLE MODULE ISP130301 Contents 1. Block Diagram ............................................................................................................................................................ 3 2. Specifications ............................................................................................................................................................. 4 2.1. Absolute Maximum Ratings ........................................................................................................................... 4 2.2. Operating Conditions ..................................................................................................................................... 4 2.3. Power Consumption ...................................................................................................................................... 5 2.4. Clock Sources ............................................................................................................................................... 5 2.5. Radio Specifications ...................................................................................................................................... 5 2.6. Electrical Schematic ...................................................................................................................................... 8 3. Pin Description ........................................................................................................................................................... 9 4. Mechanical Outlines ................................................................................................................................................ 11 4.1. Mechanical Dimensions .............................................................................................................................. 11 4.2. SMT Assembly Guidelines .......................................................................................................................... 12 4.3. Antenna Keep-Out Zone ............................................................................................................................. 13 5. Product Development Tools .................................................................................................................................. 14 5.1. Hardware ..................................................................................................................................................... 14 5.2. Firmware ...................................................................................................................................................... 14 5.3. Development Tools ..................................................................................................................................... 15 6. Reference Designs .................................................................................................................................................. 16 6.1. Sensor Board Design .................................................................................................................................. 16 6.2. Beacon Design ............................................................................................................................................ 17 7. Packaging & Ordering information ....................................................................................................................... 18 7.1. Marking ........................................................................................................................................................ 18 7.2. Prototype Packaging ................................................................................................................................... 18 7.3. Jedec Trays ................................................................................................................................................. 18 7.4. Tape and Reel ............................................................................................................................................. 19 7.5. Ordering Information ................................................................................................................................... 20 8. Storage & Soldering information .......................................................................................................................... 21 8.1. Storage and Handling .................................................................................................................................. 21 8.2. Moisture Sensitivity ..................................................................................................................................... 21 8.3. Soldering information .................................................................................................................................. 22 9. Quality & User information..................................................................................................................................... 23 9.1. Certifications ................................................................................................................................................ 23 9.2. USA User information ............................................................................................................................... 23 9.3. Canada User information ......................................................................................................................... 23 9.4. Discontinuity ................................................................................................................................................ 24 9.5. Disclaimer .................................................................................................................................................... 24 January 16, 2017 Document Ref: isp ble DS130301 R13.docx Page 2/24 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.