Eccoshield VY-81 RF Conductive Caulking Compound and Sealer RF CONDUCTIVE CAULKING COMPOUND AND SEALER Eccoshield VY-81 is a single-component electrically conductive non-hardening compound of metallic particles. It is similar to but different from our Eccoshield VY product, in that the VY-81 has an increased volume resistivity (decreased conductivity). It also has a lower density than Eccoshield VY and is more cost effective to use per pound. Once applied, Eccoshield VY-81 assures long-term integrity of the shielding enclosure and will prevent corrosion in the contact area. Due to high tack and non-hardening characteristics, Eccoshield VY-81 will function under vibration and displacement due to temperature changes. It is fast and economical to use. FEATURES AND BENEFITS MARKETS maintains good shielding effectiveness due Commercial Telecom to non-hardening characteristic of material Test and Measurement material can be applied using conventional Security and Defense caulking equipment SPECIFICATIONS TYPICAL PROPERTIES ECCOSHIELD VY-81 Service Temperature C (F) -54 to 205 (-65 to 400) Volume Resistivity Ohm-cm 0.01 Density g/cc 1.80 Shielding effectiveness dB 80 - 90 Length of 3mm diam. bead/lb, m (ft) 32 (105) Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. APPLICATIONS Eccoshield VY-81 is specifically designed for use as a shielding effective material for EMI/RF protection on structures, cabinets, conduits, modules and components. Joints, seams, threads, cracks, and other RF leakage sources can be effectively plugged. AVAILABILITY Eccoshield VY-81 is sold by the pound in one pound (16 oz.) jars. INSTRUCTIONS FOR USE Eccoshield VY-81 can be used with conventional caulking equipment to develop fast and uniform-weight beads. It can also be applied by spatula, putty knife, plastic syringe applicators, or other suitable tools such as caulking guns. For spatula application, small amount of methyl ethyl ketone (MEK) can be added to adjust consistency. All surfaces for application should be prepared by removing rust, scale, non-conductive oxides and dirt. Wire brushing and/or solvent cleaning is usually adequate. Surfaces should be bright and electrically conductive. Americas: +1.866.928.8181 Europe: +49.(0)8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com Eccoshield VY-81 Apply Eccoshield VY-81 to the prepared surface using a syringe, caulking gun, or spatula. Lap joints may be made immediately. Excess and spillage may be collected and reused. Hardened or thick material can be reactivated by the addition of small amounts of methyl ketone. For cleanup, acetone or trichloroethylene are suitable. Caution: Eccoshield VY-81 contains flammable solvents. Keep away from heat and open flames. When not in use, keep sealed to avoid evaporation. The handling of these products should present no problems if ordinary care is exercised to avoid breathing vapors, the skin is protected against contamination, swallowing is avoided, and eyes are protected. RFP-DS-VY-81 031016 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or 2 consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.