MA4P504-1072T

MA4P504-1072 MELF PIN Diode Rev. V2 1 - 4000 MHz Features Package Dimensions ODS 1072 High Power Handling A C Low Loss / Low Distortion Low Thermal Resistance denotes Surface Mountable cathode solderable Lead-Free MELF Package (1072) C surfaces Halogen-Free green Mold Compound RoHS* Compliant and 260C Re-flow Compatible Description B Front View Side View The MA4P504-1072 is a PIN diode assembled in a surface mount metal electrode leadless faced Inches Millimeters (MELF) ceramic package. This package is full face bonded to refractory metal plugs on both the anode Min. Max. Min. Max. and cathode. The result is a low loss PIN diode with A 0.115 0.125 2.921 3.175 low thermal resistance due to its symmetrical thermal paths. MELF PIN diodes are designed B 0.008 0.023 0.203 0.584 specifically for high volume tape and reel assembly. C 0.080 0.095 2.032 2.413 Their user friendly design provides for extremely easy automatic pick and place indexing and assembly. All solderable surfaces are tin plated and Diode Cross Section are compatible with all industry standard reflow and vapor phase solder processes. The MA4P504 is ideally suited for use in a series or shunt configuration where there is a high incident power present. Typical applications include switches as well as attenuators from HF through UHF frequencies. The MA4P504 is manufactured using a unique passivation process which provides for a hard glass Circuit Pad Layout encapsulation that protects and hermetically seals the active area of the chip. A 1 Ordering Information Part Number Package C B B MA4P504-1072T 1500 pc. reel Package Style 1072 Dimension 1. Reference Application Note M513 for reel size information. inches mm A 0.093 2.36 B 0.050 1.27 C 0.060 1.52 * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. 11 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MA4P504-1072 MELF PIN Diode Rev. V2 1 - 4000 MHz Electrical Specifications: T = 25C A Parameter Test Conditions Units Min. Typ. Max. Forward Voltage + 50 mA V 1.0 Reverse Leakage Current -500 V nA -100 2 Total Capacitance -100 V 1 MHz pF 0.50 Package Capacitance pF 0.16 P = +10 dBm, Spacing = 1 MHz IN Input IP3 dBm >54 1000 MHz Diode attached to infinite Heatsink 16 20 Thermal Resistance CW Diode in air 48 51 3 Diode attached to infinite Heatsink 7.5 Power Dissipation W 4 Diode in air 2.9 Minority Carrier Lifetime I = +10 mA, I = -6 mA s 1.0 F R Series Resistance +100 mA, 100 MHz 0.60 2. Chip junction capacitance + parasitic package capacitance. 3. De-rate linearly by -50.0 mW/C to 0 W +125C. 4. De-rate linearly by -19.3 mW/C to 0 W +125C. 5,6 Absolute Maximum Ratings Parameter Absolute Maximum Handling Procedures 7 Forward Voltage 1.0 V Please observe the following precautions to avoid 7 damage: Reverse Voltage 500 V Operating Temperature -65C to +175C Static Sensitivity These electronic devices are sensitive to Storage Temperature -65C to +200C electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques 5. Exceeding any one or combination of these limits may cause permanent damage to this device. should be used when handling these Class 1C 6. MACOM does not recommend sustained operation near these devices. survivability limits. 7. Values will de-rate linearly over temperature. 22 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: