MMD820-C12

Silicon Step Recovery Diodes MMDx & SMMDx Series Rev. V4 Features Output Combs to 40+ GHz Transition Times down to 35 ps Plastic SMT w/leads Screening per MIL-PRF-19500 and MIL-PRF- 38534 available Description The diodes feature fully passivated, true mesa construction for sharp transitions and improved stability. The beam lead SRDs have the industrys fastest transition times for millimeter wave multiplication and picoseconds pulse forming. Chip & Beam Lead Electrical Specifications: T = 25C A Voltage Junction Transition Frequency Lifetime Theta Breakdown Capacitance Time Cutoff (t) ( ) JC (V ) (C ) (t ) (F ) B J t CO Model V pF ns ps GHz C/W Min. Min. Max. Min. Typ. Typ. Max. Typ. Max. Chip MMD805-C12 60 2.5 3.5 80 100 250 300 130 15 MMD810-C12 50 1.5 2.5 40 70 200 250 200 22 MMD820-C12 40 1.0 1.7 30 60 80 100 390 25 MMD830-C11 25 0.5 1.0 15 30 60 80 700 45 MMD832-C11 20 0.4 0.8 10 15 60 80 660 50 MMD835-C11 15 0.3 0.7 10 20 60 70 800 60 MMD837-C11 20 0.2 0.4 5 10 60 70 1300 60 MMD840-C11 15 0.2 0.4 7 15 60 70 880 60 Beam Lead MMDB30-B11 14 0.15 0.25 1 4 30 38 530 600 MMDB35-B11 16 0.13 0.20 1 4 35 45 482 600 MMDB45-B11 25 0.11 0.20 3 8 45 58 410 600 Test Conditions: V : I = 10 A B R C : V = 6 V, 1 MHz J R t: I = 10 mA, I = 6 mA 50% Recovery F R t : for Chip: I = 10 mA, V = 10 V t F R t : for Beam Lead: I = 3 mA, V = 7 V t F R F : 1/2R CO S 11 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: h t t p s: //www.m a co m .co m /su p p o rt DC-0012557 Silicon Step Recovery Diodes MMDx & SMMDx Series Rev. V4 Absolute Maximum Ratings Parameters Rating Reverse Voltage Rated V BR Chip = 150 mA Forward Current Beam Lead = 50 mA 150C / +25C, JC CW Power Dissipation derate linearly to zero T = +175C HSK Operating / Storage Temperature -65C to +175C Chip = +310C for 30 seconds Mounting / Bonding Temperature Beam Lead = +235C for 10 seconds Chip & Beam Lead Outline Drawings 22 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: h t t p s: //www.m a co m .co m /su p p o rt DC-0012557