X-On Electronics has gained recognition as a prominent supplier of APT30M19JVFR discrete semiconductor modules across the USA, India, Europe, Australia, and various other global locations. APT30M19JVFR discrete semiconductor modules are a product manufactured by Microchip. We provide cost-effective solutions for discrete semiconductor modules, ensuring timely deliveries around the world.

APT30M19JVFR Microchip

APT30M19JVFR electronic component of Microchip
Images are for reference only
See Product Specifications
Part No.APT30M19JVFR
Manufacturer: Microchip
Category:Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules FG, FREDFET, 300V, 0.019_OHM, SOT-227
Datasheet: APT30M19JVFR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 101.4536 ea
Line Total: USD 101.45

Availability - 1
Ships to you between
Fri. 07 Jun to Thu. 13 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1 - WHS 1


Ships to you between Fri. 07 Jun to Thu. 13 Jun

MOQ : 1
Multiples : 1
1 : USD 98.657

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Vgs - Gate-Source Voltage
Mounting Style
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Technology
Configuration
Transistor Type
Brand
Number Of Channels
Transistor Polarity
Channel Mode
Cnhts
Fall Time
Hts Code
Id - Continuous Drain Current
Mxhts
Pd - Power Dissipation
Product Type
Qg - Gate Charge
Rds On - Drain-Source Resistance
Rise Time
Factory Pack Quantity :
Subcategory
Taric
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Vds - Drain-Source Breakdown Voltage
Vgs Th - Gate-Source Threshold Voltage
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We are delighted to provide the APT30M19JVFR from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the APT30M19JVFR and other electronic components in the Discrete Semiconductor Modules category and beyond.

APT30M19JVFR 300V 130A 0.019 FREDFET POWER MOS V Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V also achieves faster switching speeds through optimized gate layout. ISOTOP Fast Recovery Body Diode 100% Avalanche Tested D FREDFET Lower Leakage Popular SOT-227 Package G Faster Switching S MAXIMUM RATINGS All Ratings: T = 25C unless otherwise specified. C Symbol Parameter APT30M19JVFR UNIT V Drain-Source Voltage 300 Volts DSS I Continuous Drain Current T = 25C 130 D C Amps 1 I Pulsed Drain Current 520 DM V Gate-Source Voltage Continuous 30 GS Volts V Gate-Source Voltage Transient 40 GSM Total Power Dissipation T = 25C 700 Watts C P D Linear Derating Factor 5.6 W/C T ,T Operating and Storage Junction Temperature Range -55 to 150 J STG C T Lead Temperature: 0.063 from Case for 10 Sec. 300 L 1 I Avalanche Current (Repetitive and Non-Repetitive) 130 Amps AR 1 E 50 Repetitive Avalanche Energy AR mJ 4 E Single Pulse Avalanche Energy 3600 AS STATIC ELECTRICAL CHARACTERISTICS Symbol Characteristic / Test Conditions MIN TYP MAX UNIT BV Drain-Source Breakdown Voltage (V = 0V, I = 250A) 300 Volts DSS GS D 2 I On State Drain Current (V > I x R Max, V = 10V) Amps 130 D(on) DS D(on) DS(on) GS 2 R Drain-Source On-State Resistance (V = 10V, 0.5 I ) Ohms 0.019 DS(on) GS D Cont. Zero Gate Voltage Drain Current (V = V , V = 0V) 250 DS DSS GS I A DSS Zero Gate Voltage Drain Current (V = 0.8 V , V = 0V, T = 125C) 1000 DS DSS GS C I Gate-Source Leakage Current (V = 30V, V = 0V) nA 100 GSS GS DS V Gate Threshold Voltage (V = V , I = 5mA) Volts 24 GS(th) DS GS D CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - APT30M19JVFR DYNAMIC CHARACTERISTICS Symbol Characteristic Test Conditions MIN TYP MAX UNIT C Input Capacitance 18000 21600 iss V = 0V GS C Output Capacitance 3250 4550 pF V = 25V oss DS C f = 1 MHz Reverse Transfer Capacitance 980 1470 rss 3 Q Total Gate Charge V = 10V 650 975 g GS V = 0.5 V Q nC Gate-Source Charge 115 175 gs DD DSS I = I Cont. 25C Q Gate-Drain Mille) Charge D D 290 435 gd t (on) Turn-on Delay Time 22 44 d V = 15V GS t V = 0.5 V Rise Time 33 66 r DD DSS ns I = I Cont. 25C t (off) Turn-off Delay Time 70 135 d D D R = 0.6 t G Fall Time 10 20 f SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Symbol Characteristic / Test Conditions MIN TYP MAX UNIT Continuous Source Current (Body Diode) I 130 S Amps 1 I Pulsed Source Current (Body Diode) 520 SM 2 V Diode Forward Voltage (V = 0V, I = -I Cont. ) 1.3 Volts SD GS S D dv dv 5 Peak Diode Recovery / 5 V/ns / dt dt Reverse Recovery Time T = 25C 200 300 j ns t rr di (I = -I Cont. , / = 100A/s) S D dt T = 125C 250 525 j Reverse Recovery Charge T = 25C 1.5 j Q C rr di (I = -I Cont. , / = 100A/s) S D dt T = 125C 4.4 j Peak Recovery Current T = 25C 15 j I Amps RRM di (I = -I Cont. , / = 100A/s) S D dt T = 125C 25 j THERMAL/PACKAGE CHARACTERISTICS Symbol Characteristic MIN TYP MAX UNIT Junction to Case 0.18 R JC C/W R Junction to Ambient 40 JA V RMS Voltage (50-60 Hz Sinusoidal Waveform From Terminals to Mounting Base for 1 Min.) 2500 Volts Isolation Torque Maximum Torque for Device Mounting Screws and Electrical Terminations. 13 lbin 1 3 Repetitive Rating: Pulse width limited by maximum junction See MIL-STD-750 Method 3471 4 temperature. Starting T = +25C, L = 426H, R = 25, Peak I = 130A j G L 2 5 di Pulse Test: Pulse width < 380 S, Duty Cycle < 2% I -I Cont. , / = 100A/s, V V , T 150C, R = 2.0, S D DD DSS j G dt V = 200V R APT Reserves the right to change, without notice, the specifications and information contained herein. 0.2 D=0.5 0.1 0.05 0.2 0.1 0.05 0.01 Note: 0.02 0.005 t 1 0.01 t SINGLE PULSE 2 t 1 Duty Factor D = / t 2 0.001 Peak T = P x Z + T J DM JC C 0.0005 -5 -4 -3 -2 -1 10 10 10 10 10 1.0 10 RECTANGULAR PULSE DURATION (SECONDS) FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION 050-5604 Rev B Z , THERMAL IMPEDANCE (C/W) JC P DM

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
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