MPX2010DP NXP

MPX2010 Series 10 kPa Temperature Compensated Pressure Sensors Rev. 14 27 April 2021 Product data sheet 1 General Description The MPX2010 series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. 2 Features and Benefits Ratiometric to Supply Voltage Differential and Gauge Options Temperature Compensated over 0 C to 85 C Easy-to-Use Chip Carrier Package Options 3 Applications Air Movement Control Respiratory Diagnostics Controllers Pressure SwitchingNXP Semiconductors MPX2010 Series 10 kPa Temperature Compensated Pressure Sensors 4 Ordering Information Number of ports Pressure type Package Case Device name Device marking options number None Single Dual Gauge Differential Absolute Small Outline Package (MPXV2010 Series) MPXV2010GP Tray 1369 MPXV2010GP MPXV2010DP Tray 1351 MPXV2010DP Unibody Package (MPX2010 Series) MPX2010D Tray 344 MPX2010D MPX2010DP Tray 344C MPX2010DP MPX2010GP Tray 344B MPX2010GP MPX2010GSX Tray 344F MPX2010D MPAK Package (MPXM2010 Series) MPXM2010GS Rail 1320A MPXM2010GS MPXM2010GST1 Tape & Reel 1320A MPXM2010GS Small outline packages MPAK Packages MPXV2010GP MPXV2010DP MPXM2010GS/GST1 Case 1369-01 Case 1351-01 Case 1320A-02 Unibody Packages aaa-041213 aaa-041242 aaa-041665 MPX2010D MPX2010GP MPX2010DP MPX2010GSX Case 344-15 Case 344B-01 Case 344C-01 Case 344F-01 MPX2010 All information provided in this document is subject to legal disclaimers. NXP B.V. 2021. All rights reserved. Product data sheet Rev. 14 27 April 2021 2 / 26