X-On Electronics has gained recognition as a prominent supplier of P1011NSE2FFB microprocessors - mpu across the USA, India, Europe, Australia, and various other global locations. P1011NSE2FFB microprocessors - mpu are a product manufactured by NXP. We provide cost-effective solutions for microprocessors - mpu, ensuring timely deliveries around the world.

P1011NSE2FFB NXP

P1011NSE2FFB electronic component of NXP
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Part No.P1011NSE2FFB
Manufacturer: NXP
Category:Microprocessors - MPU
Description: MPU QorIQ P1011 RISC 32bit 45nm 667MHz 689-Pin TEBGA II Tray
Datasheet: P1011NSE2FFB Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 82.9571
25 : USD 81.3253
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Obsolete
     
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We are delighted to provide the P1011NSE2FFB from our Microprocessors - MPU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the P1011NSE2FFB and other electronic components in the Microprocessors - MPU category and beyond.

Freescale Semiconductor Document Number: P1011EC Data Sheet: Technical Data Rev. 1, 03/2012 P1011 P1011 QorIQ Integrated Processor Hardware Specifications One four-channel DMA controller The following list provides an overview of the feature set: 2 Two I C controllers, DUART, timers A high-performance 32-bit core, built on Power Enhanced local bus controller (eLBC) Architecture technology: TDM 36-bit physical addressing 16 general-purpose I/O signals Double-precision floating-point support Operating junction temperature (T ) range: 0125C and 32 Kbyte L1 instruction cache and 32 Kbyte L1 data j 40C to 125C (industrial specification) cache for each core 31 31 mm 689-pin WB-TePBGA II (wire bond 533 MHz to 800 MHz clock frequency temperature-enhanced plastic BGA) 256 Kbyte L2 cache with ECC. Also configurable as SRAM and stashing memory. Three 10/100/1000 Mbps enhanced three-speed Ethernet controllers (eTSECs) TCP/IP acceleration, quality of service, and classification capabilities IEEE 1588 support Lossless flow control MII, RMII, RGMII, SGMII High-speed interfaces supporting various multiplexing options: Four SerDes upto 2.5 GHz/lane multiplexed across controllers Two PCI Express interfaces Two SGMII interfaces High-Speed USB controller (USB 2.0) Host and device support Enhanced host controller interface (EHCI) ULPI interface to PHY Enhanced secure digital host controller (SD/MMC) Enhanced Serial peripheral interface (eSPI) Integrated security engine Protocol support includes ARC4, 3DES, AES, RSA/ECC, RNG, single-pass SSL/TLS XOR acceleration 32-bit DDR2/DDR3 SDRAM memory controller with ECC support Programmable interrupt controller (PIC) compliant with OpenPIC standard 2012 Freescale Semiconductor, Inc. All rights reserved.Table of Contents 1 Pin Assignments and Reset States 4 2.13 Enhanced Local Bus 75 1.1 Ball Layout Diagrams .4 2.14 Enhanced Secure Digital Host Controller (eSDHC) 79 1.2 Pinout Assignments 9 2.15 Programmable Interrupt Controller (PIC) Specifications81 2 Electrical Characteristics 33 2.16 JTAG 82 2.1 Overall DC Electrical Characteristics 33 2.17 I2C 84 2.2 Power Sequencing 37 2.18 GPIO 87 2.3 Power Down Requirements .37 2.19 TDM . 89 2.4 RESET Initialization .37 2.20 High-Speed Serial Interfaces (HSSI) 91 2.5 Power-on Ramp Rate 38 2.21 PCI Express . 97 2.6 Power Characteristics 39 3 Thermal 102 2.7 Input Clocks .41 3.1 Thermal Characteristics . 102 2.8 DDR2 and DDR3 SDRAM 44 3.2 Temperature Diode 102 2.9 eSPI .53 4 Package Information 102 2.10 DUART .55 4.1 Package Parameters for the P1011 WB-TePBGA II . 102 2.11 Ethernet: Enhanced Three-Speed Ethernet (eTSEC) 4.2 Ordering Information . 105 (10/100/1000Mbps)MII/RMII/RGMII/SGMII Electrical 5 Product Documentation 105 Characteristics .56 6 Revision History . 106 2.12 USB 72 P1011 QorIQ Integrated Processor Hardware Specifications, Rev. 1 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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