X-On Electronics has gained recognition as a prominent supplier of QN9080DHNE rf system on a chip - soc across the USA, India, Europe, Australia, and various other global locations. QN9080DHNE rf system on a chip - soc are a product manufactured by NXP. We provide cost-effective solutions for rf system on a chip - soc, ensuring timely deliveries around the world.

QN9080DHNE NXP

QN9080DHNE electronic component of NXP
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Part No.QN9080DHNE
Manufacturer: NXP
Category:RF System on a Chip - SoC
Description: RF System on a Chip - SoC BTLE SoC
Datasheet: QN9080DHNE Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 25.1107 ea
Line Total: USD 25.11

Availability - 8
Ships to you between
Mon. 24 Jun to Thu. 27 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
8 - WHS 1


Ships to you between
Mon. 24 Jun to Thu. 27 Jun

MOQ : 1
Multiples : 1
1 : USD 10.9637
10 : USD 10.1538
30 : USD 8.7496
100 : USD 7.5278

   
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QN908x Ultra low power Bluetooth 5 system-on-chip solution Rev. 1.3 6 January 2021 Product data sheet 1. Introduction QN908x is an ultra low power Bluetooth Low Energy wireless MCU with on-chip memory, USB 2.0 full-speed compliant device interface, and 16-bit ADC for Bluetooth Smart applications. QN9080 integrates a 32-bit ARM Cortex-M4F core with Bluetooth Low Energy (v5.0) compliant radio, link controller, host stack and GATT profiles. The 32-bit ARM Cortex-M4F MCU and on-chip memory provides additional signal processing and scope to run applications for a true single-chip Bluetooth Low Energy (v5.0) solution. The QN908x uses a multi-layer AHB matrix to connect the ARM Cortex-M4 buses and other bus masters to peripherals in a flexible manner. It optimizes performance by allowing peripherals that are on different slave ports of the matrix to be accessed simultaneously by different bus masters. 2. General description The QN908x is a single chip, 1.6 mW peak power, high performance Bluetooth Low Energy SoC platform. It facilitates the development of end products such as wearables, health, and sport and fitness trackers. The end products also include retail beacons, connected smart home appliances, smart remote controls, HID devices, asset trackers, and home automation. QN9080 provides single-chip solution for Bluetooth Smart applications by integrating a Bluetooth Low Energy (v5.0) compliant radio, link controller, host stack and GATT profiles. The integrated 32-bit ARM Cortex-M4F MCU with on-chip flash memory and a mix of analogue and digital peripherals provides the most efficient data fusion engine. The feature makes it a superior solution for applications requiring significant sensor fusion computation. Additional system features include a fully integrated DC-to-DC converter, LDO, low-power sleep timer, battery monitor, high resolution ADC, and GPIO. These features reduce overall system cost and size. The QN908x operates with a power supply range of 1.62 V to 3.6 V. The best in-class active current, with ultra-low power sleep modes, give excellent battery life allowing operation from a coin cell battery. NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. NXP Semiconductors QN908x Bluetooth Low Energy microcontroller with 32-bit ARM Cortex-M4 3. Features and benefits True single-chip Bluetooth Low Energy (v5.0) SoC solution Integrated Bluetooth LE radio, protocol stack and application profiles Supports central and peripherals roles Supports master/slave concurrency Supports 16 simultaneous links Supports secure connections Supports data packet length extension Wifi/Bluetooth LE coexistence interface 48-bit unique bluetooth device address RF 95dBm RX sensitivity in 1Mbps mode, -92dBm RX sensitivity in 2Mbps mode (LDO mode) 94dBm RX sensitivity in 1Mbps mode, -91.5dBm RX sensitivity in 2Mbps mode (DC-to-DC converter mode) Fast and reliable RSSI in 1dB step TX output power from 20 dBm to 2 dBm Single-ended RF port with integrated balun Generic FSK modulation with programmed data rate from 250Kbps to 2Mbps Compatible with worldwide radio frequency regulations Very low power consumption Single 1.62 V to 3.6 V power supply Integrated DC-to-DC buck converter and LDO 1.0 A power-down 1 mode, to wake up by GPIO 2.5 A power-down 0 mode, to wake up by 32 kHz sleep timer, RTC and GPIO 3.5 mA RX current with DC-to-DC convertor enabled at 3 V supply in 1Mbps mode 5.0 mA RX current with DC-to-DC convertor enabled at 3 V supply in 2Mbps mode 3.5 mA TX current 0 dBm TX power with DC-to-DC converter enabled at 3 V supply in both 1Mbps and 2Mbps mode ARM Cortex-M4 core (version r0p1) ARM Cortex-M4 processor, running at a frequency of up to 32 MHz Floating Point Unit (FPU) and Memory Protection Unit (MPU) ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC) Serial Wire Debug (SWD) with six instruction breakpoints, two literal comparators, and four watch points, including serial wire output for enhanced debug capabilities System tick timer On-chip memory 512 kB on-chip flash program memory and 2 kB page erase and write 128 kB SRAM 256 kB ROM ROM API support Flash In-System Programming (ISP) Serial interfaces Four Flexcomm serial peripherals QN908x All information provided in this document is subject to legal disclaimers. NXP B.V. 2021. All rights reserved. Product data sheet Rev. 1.3 6 January 2021 2 of 80

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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