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HGT1S12N60A4DS

HGT1S12N60A4DS electronic component of ON Semiconductor
Part No.HGT1S12N60A4DS
Manufacturer: ON Semiconductor
Category:IGBT Transistors
Description: 600V, SMPS Series N-Channel IGBT with Anti-Parallel Hyperfas
Datasheet: HGT1S12N60A4DS Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

3: USD 10.1063 ea
Line Total: USD 30.32

142 - Global Stock
Ships to you between
Thu. 30 May to Wed. 05 Jun
MOQ: 3  Multiples: 1
Pack Size: 1
Availability Price Quantity
142 - WHS 1


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 3
Multiples : 1
3 : USD 10.1063
400 : USD 3.0712

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SMPS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode 600 V HGTG12N60A4D, www.onsemi.com HGTP12N60A4D, HGT1S12N60A4DS C The HGTG12N60A4D, HGTP12N60A4D and HGT1S12N60A4DS are MOS gated high voltage switching devices G combining the best features of MOSFETs and bipolar transistors. These devices have the high input impedance of a MOSFET and the E low onstate conduction loss of a bipolar transistor. The much lower onstate voltage drop varies only moderately between 25C and COLLECTOR 150C. The IGBT used is the development type TA49335. The diode (FLANGE) used in antiparallel is the development type TA49371. TO2203LD This IGBT is ideal for many high voltage switching applications CASE 340AT JEDEC ALTERNATE operating at high frequencies where low conduction losses are VERSION essential. This device has been optimized for high frequency switch G C E mode power supplies. Formerly Developmental Type TA49337. COLLECTOR 2 (FLANGE) D PAK3 Features (TO263, 3LEAD) CASE 418AJ >100 kHz Operation 390 V, 12 A JEDEC STYLE 200 kHz Operation 390 V, 9A G E 600 V Switching SOA Capability E C G Typical Fall Time 70 ns at T = 125C J TO2473LD Low Conduction Loss SHORT LEAD CASE 340CK Temperature Compensating Saber Model COLLECTOR JEDEC STYLE (FLANGE) Related Literature TB334 Guidelines for Soldering Surface Mount Components to PC Boards MARKING DIAGRAM These are PbFree Devices $Y&Z&3&K $Y&Z&3&K $Y&Z&3&K 12N60A4D 12N60A4D 12N60A4D $Y = ON Semiconductor Logo &Z = Assembly Plant Code &3 = Numeric Date Code &K = Lot Code 12N60A4D = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 8 of this data sheet. Semiconductor Components Industries, LLC, 2001 1 Publication Order Number: April, 2020 Rev. 3 HGT1S12N60A4DS/DHGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise specified) C HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS Parameter Symbol Unit Collector to Emitter Voltage BV 600 V CES Collector Current Continuous I 54 A At T = 25C C25 C I 23 A At T = 110C C110 C Collector Current Pulsed (Note 1) I 96 A CM Gate to Emitter Voltage Continuous V 20 V GES Gate to Emitter Voltage Pulsed V 30 V GEM Switching Safe Operating Area at T = 150C, Figure 2 SSOA 60 A at 600 V J Power Dissipation Total at T = 25C P 167 W C D Power Dissipation Derating T > 25C 1.33 W/C C Operating and Storage Junction Temperature Range T , T 55 to 150 C J STG Maximum Temperature for Soldering Leads at 0.063 in (1.6 mm) from Case for 10 s T 300 C L Package Body for 10 s, see Tech Brief 334. T 260 C pkg Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Pulse width limited by maximum junction temperature. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit Collector to Emitter Breakdown Voltage BV I = 250 A, V = 0 V 600 V CES C GE Collector to Emitter Leakage Current I V = 600 V T = 25C 250 A CES CE J T = 125C 2.0 mA J Collector to Emitter Saturation Voltage V I = 12 A, V = 15 V T = 25C 2.0 2.7 V CE(SAT) C GE J T = 125C 1.6 2.0 V J Gate to Emitter Threshold Voltage V I = 250 A, V = 600 V 5.6 V GE(TH) C CE Gate to Emitter Leakage Current I V = 20 V 250 nA GES GE Switching SOA SSOA T = 150C, R = 10 , V = 15 V, 60 A J G GE L = 100 H, V = 600 V CE Gate to Emitter Plateau Voltage V I = 12 A, V = 300 V 8 V GEP C CE OnState Gate Charge Q I = 12 A, V = 300 V V = 15 V 78 96 nC g(ON) C CE GE V = 20 V 97 120 nC GE Current TurnOn Delay Time t IGBT and Diode at T = 25C, 17 ns J d(ON)I I = 12 A, CE Current Rise Time t 8 ns rI V = 390 V, CE V = 15 V, GE Current TurnOff Delay Time t 96 ns d(OFF)I R = 10 , G Current Fall Time t 18 ns L = 500 H, fI Test Circuit (Figure 24) TurnOn Energy (Note 3) E 55 J ON1 TurnOn Energy (Note 3) E 160 J ON2 TurnOff Energy (Note 2) E 50 J OFF Current TurnOn Delay Time t IGBT and Diode at T = 125C, 17 ns d(ON)I J I = 12 A, CE Current Rise Time t 16 ns rI V = 390 V, CE V = 15 V, Current TurnOff Delay Time t GE 110 170 ns d(OFF)I R = 10 , G Current Fall Time t 70 95 ns L = 500 H, fI Test Circuit (Figure 24) TurnOn Energy (Note 3) E 55 J ON1 TurnOn Energy (Note 3) E 250 350 J ON2 TurnOff Energy (Note 2) E 175 285 J OFF www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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