F2977EVBI Renesas

High Linearity Broadband SP2T F2977 Datasheet 30MHz to 6GHz Description Features The F2977 is a 50 single-pole double-throw (SP2T) reflective RF Low insertion loss: switch featuring high linearity and wide bandwidth. This device is 0.38dB at 2.4GHz optimized from 30MHz to 6GHz to support a multitude of wireless 0.45dB at 6GHz RF applications. The F2977 uses a single positive supply voltage High Isolation: of either +3.3V or +5.0V and is compatible with either 1.8V or 3.3V 39dB at 2.4GHz control logic. High Linearity: IIP2 +125dBm at 2.4GHz Competitive Advantage IIP3 +77dBm at 2.4GHz The F2977 provides extremely low insertion loss across the entire P0.1dB compression of +40dBm at 2.4GHz bandwidth while providing superb distortion performance. Second Harmonic: -95dBc at 900MHz Low insertion loss Third Harmonic: -90dBc at 900MHz High isolation Supply voltage: +2.7V to +5.25V Low distortion 1.8V and 3.3V compatible control logic Fast switching -40C to +105C operating temperature range No external matching required 2mm x 2mm, 12-pin VFQFP-N package Typical Applications Block Diagram Cellular BTS Figure 1. Block Diagram Cellular BTS small cell Transmit / Receive switching Post PA switching RFC General purpose RF1 RF2 EN V CTL 2017 Integrated Device Technology, Inc. 1 Rev O May 19, 2017 F2977 Datasheet Pin Assignments Figure 2. Pin Assignments for 2mm x 2mm x 0.5mm 12-pin VFQFP-N, NEG12 Top View RF2 GND GND 21 11 01 GND 1 VCC 9 RFC 2 EN F2977 8 GND 3 VCTL 7 EP 4 5 6 GND RF1 GND Pin Descriptions Table 1. Pin Descriptions Number Name Description 1 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 2 RFC RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used. 3 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 4 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 5 RF1 RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used. 6 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 7 V Logic control pin. CTL Active HIGH enable pin. If LOW, neither RF1 nor RF2 are connected to RFC. Pin is internally pulled up to 8 EN 2.5V through a 500k resistor. Power supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as 9 V CC possible to pin. 10 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 11 RF2 RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used. 12 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple EP ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the specified RF performance. 2017 Integrated Device Technology, Inc. 2 Rev O May 19, 2017