S34ML16G2 16-Gbit, 4-Bit ECC, 8 I/O, 3 V V CC NAND Flash for Embedded General Description Cypress S34ML16G2 16-Gb NAND is offered in 3.3 V with 8 I/O interface. This document contains information for the CC S34ML16G2 device, which is a quad-die stack of four S34ML04G2 die. For detailed specifications, please refer to the discrete die data sheet: S34ML01G2 04G2. Distinctive Characteristics Density Security 16-Gb (4-Gb 4) One Time Programmable (OTP) area Serial number (unique ID) Architecture (For each 4-Gb device) Hardware program/erase disabled during power transition Input / Output Bus Width: 8-bits Page Size: (2048 + 128) bytes 128-byte spare area Additional Features Block Size: 64 Pages or (128k + 8k) bytes Supports Multiplane Program and Erase commands Plane Size Supports Copy Back Program 2048 Blocks per Plane or (256M + 16M) bytes Supports Multiplane Copy Back Program Device Size Supports Read Cache 2 Planes per Device or 512 Mbyte Electronic Signature NAND Flash Interface Manufacturer ID: 01h Open NAND Flash Interface (ONFI) 1.0 compliant Operating Temperature Address, Data and Commands multiplexed Industrial: 40 C to 85 C Supply Voltage 3.3 V device: Vcc = 2.7 V ~ 3.6 V Performance Page Read / Program Reliability Random access: 30 s (Max) 100,000 Program / Erase cycles (Typ) (with 4-bit ECC per 528 bytes) Sequential access: 25 ns (Min) 10 Year Data retention (Typ) Program time / Multiplane Program time: 300 s (Typ) Blocks zero and one are valid and will be valid for at least Block Erase / Multiplane Erase 1000 Block Erase time: 3.5 ms (Typ) program-erase cycles with ECC Package Options Lead Free and Low Halogen 48-Pin TSOP 12 20 1.2 mm 63-Ball BGA 9 11 1.2 mm Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 001-98528 Rev. *E Revised May 05, 2017S34ML16G2 Contents General Description ............................................................. 1 7. Electrical Characteristics........................................... 12 7.1 Valid Blocks .................................................................. 12 Distinctive Characteristics .................................................. 1 7.2 DC Characteristics........................................................ 12 Performance.......................................................................... 1 7.3 Pin Capacitance............................................................ 12 7.4 Power Consumptions and Pin Capacitance 1. Connection Diagram.................................................... 3 for Allowed Stacking Configurations ............................. 13 2. Pin Description............................................................. 4 8. Physical Interface ....................................................... 14 3. Block Diagrams............................................................ 5 8.1 Physical Diagram.......................................................... 14 4. Addressing ................................................................... 7 9. Ordering Information.................................................. 16 5. Read Status Enhanced ................................................ 7 10. Document History....................................................... 17 6. Read ID.......................................................................... 8 6.1 Read Parameter Page ................................................... 9 Document Number: 001-98528 Rev. *E Page 2 of 18