CUSTOMER DRAWING
Product Dimensions Cable Dimensions
Part Names L A B K D E F
J1
max min min min max min min
(J0.04)
16.5 2.6 3.1 150 2.6 1.6 1.5 7
B-058-00
(0.650) (0.100) (0.120) (5.900) (0.100) (0.630) (0.060) (0.275)
16.5 4.4 4.9 150 4.4 2.2 2.1 7
B-058-01
(0.650) (0.175) (0.195) (5.900) (0.175) (0.085) (0.080) (0.275)
22.1 6.9 7.4 150 6.9 3.4 3.2 7
B-058-02
(0.870) (0.270) (0.290) (5.900) (0.270) (0.135) (0.125) (0.275)
MATERIAL
1. INSULATION SLEEVE: Heat-shrinkable, radiation cross-linked modified polyvinylidene fluoride. Transparent blue.
2. SOLDER PREFORM WITH FLUX:
SOLDER: TYPE Sn63 per ANSI J-STD-006.
FLUX: TYPE ROL0 per ANSI J-STD-004.
3. & 4. MELTABLE RINGS: Thermally stabilized thermoplastic. Color: clear.
5. GROUND LEAD: RAYCHEM 55A0111-24 in accordance with MIL-W-22759/32 24 AWG. Stranded tin plated copper.
Color: blue.
APPLICATION
1. These parts are designed to provide an environment protected shield termination on cables rated for 125C minimum, meeting
the dimensional criteria listed and having tin or silver-plated shields.
2. Temperature range: -55C to +150C.
3. Install using TE Connectivity approved convection or infrared heating tools in accordance with Raychem installation procedure
RPIP-709-00.
For best results, prepare the cable as shown:
TITLE :
Raychem
SOLDERSLEEVE DEVICE WITH PRE-
Devices
NSTALLED LEAD
UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS.
DOCUMENT NO.: B-058-0X
INCHES DIMENSIONS ARE IN BETWEEN BRACKETS.
TOLERANCES: ANGLES: N/A TE Connectivity reserves the right to DOCUMENT REVISION: REVISION ISSUE DATE:
0.00 N/A amend this drawing at any time. Users
E 12-MAR-2020
0.0 N/A ROUGHNESS IN should evaluate the suitability of the
0 N/A MICRON product for their application.
DRAWN BY: DATE: CAGE CODE: ECO NUMBER: SCALE: SIZE: SHEET:
R. MAPALO 16-OCT-1998 06090 ECO-20-003669 NONE A 1 of 1
1998 - 2020 TE Connectivity Corporation. All Rights Reserved.
TE Connectivity, TE Connectivity (logo), Raychem and SolderSleeve are trademarks. X-ON Electronics
Largest Supplier of Electrical and Electronic Components
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