X-On Electronics has gained recognition as a prominent supplier of ACS422D68TAGZBX Interface - CODECs across the USA, India, Europe, Australia, and various other global locations. ACS422D68TAGZBX Interface - CODECs are a product manufactured by Tempo Semiconductor. We provide cost-effective solutions for Interface - CODECs, ensuring timely deliveries around the world.

ACS422D68TAGZBX Tempo Semiconductor

ACS422D68TAGZBX electronic component of Tempo Semiconductor
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Part No.ACS422D68TAGZBX
Manufacturer: Tempo Semiconductor
Category: Interface - CODECs
Description: Interface - CODECs LP DDX Class-D Codex Digital Filterless
Datasheet: ACS422D68TAGZBX Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Obsolete
Availability Price Quantity
0
MOQ : 490
Multiples : 490
490 : USD 5.1572
980 : USD 4.8823
1470 : USD 4.5551
2450 : USD 4.5551
5390 : USD 4.4635
10290 : USD 4.2802
N/A

Obsolete
   
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DATASHEET PORTABLE CONSUMER CODEC ACS422x00 LOW-POWER, HIGH-FIDELITY INTEGRATED CODEC DESCRIPTION FEATURES The ACS422x00 is a low-power, high-fidelity integrated High fidelity 24-bit stereo CODEC DAC 102dB SNR THD+N better than -82dB CODEC targeted at portable applications such as tablet ADC 90dB SNR, THD + N better than -80dB computers, personal navigation devices, portable projec- tors and speaker docks. In addition to a high-fidelity Built in audio controls and processing TM 3D stereo enhancement low-power CODEC, the device integrates a DDX Dual (cascaded) stereo 6-band parametric equalizers class-D speaker amplifier, a true cap-less headphone Programmable Compressor/Limiter/Expander amplifier, and four programmable system PLLs to enable Psychoacoustic Bass and Treble enhancement the timing management of the systems applications pro- processing cessor, USB interface, secondary audio and other subsys- TM Filterless Stereo DDX Class D tems. Beyond high-fidelity for portable systems, the device Speaker Driver offers an enriched audio presence through built-in audio 1W/channel (8 ) or 2W/channel processing capability The ACS422x00 has been designed (4), 0.05% THD+N typical with rapid customization in mind. IDT is able to rapidly pro- TM Tri-state DDX Class D achieves low EMI and high vide varying levels of integration, additional audio process- efficiency ing, more or fewer PLLs, etc, according to the needs of >80% efficiency at 1W large markets or customers. Spread spectrum support for reduced EMI output power mode Anti-Pop circuitry TARGET APPLICATIONS On-chip true cap-less headphone driver Tablet Computers 35 mW output power (16) Charge-pump allows true ground centered outputs Portable Navigation Devices SNR of 102dB Personal Media Players I2S data interface Portable Projectors Microphone/line-in interface Speaker Docks Analog microphone or line-in inputs Digital microphone (ACS422D00) Automatic level control 4 on-chip low-jitter PLLs for internal and system timing Multiple frequency options Spread spectrum support Low power with built in power management 1.7 V CODEC supports 1Vrms Very low standby and no-signal power consumption 1.8V digital / 1.7V analog supply for low power 2 2-wire (I C compatible) control interface 68-pin dual row 6x6 mm Thermal Leadless Array package TM DDX and the DDX logo are trademarks of Apogee Technology. 1 V1.6 08/13 2011 INTEGRATED DEVICE TECHNOLOGY, INC. ACS422X00ACS422x00 LOW-POWER, HIGH-FIDELITY, INTEGRATED CODEC TABLE OF CONTENTS 1. OVERVIEW ................................................................................................................................ 8 1.1. Block Diagram ...................................................................................................................................8 1.2. Audio Outputs ....................................................................................................................................8 1.3. Audio Inputs .......................................................................................................................................9 1.4. On-Chip PLLs ....................................................................................................................................9 2. POWER MANAGEMENT ........................................................................................................ 10 2.1. Control Registers .............................................................................................................................10 2.2. Stopping the Master Clock ...............................................................................................................11 3. OUTPUT AUDIO PROCESSING ............................................................................................. 12 3.1. DC Removal ....................................................................................................................................12 3.2. Volume Control ................................................................................................................................13 3.3. Digital DAC Volume Control .............................................................................................................14 3.4. Parametric Equalizer .......................................................................................................................14 3.4.1. Prescaler & Equalizer Filter ...............................................................................................15 3.4.2. EQ Registers ......................................................................................................................16 3.4.3. Equalizer, Bass, Treble Coefficient & Equalizer Prescaler RAM .......................................17 3.5. Gain and Dynamic Range Control ...................................................................................................20 3.6. Limiter ..............................................................................................................................................21 3.7. Compressor .....................................................................................................................................21 3.7.1. Configuration ......................................................................................................................22 3.7.2. Controlling parameters .......................................................................................................23 3.7.3. Overview ............................................................................................................................23 3.7.4. Limiter/Compressor Registers ............................................................................................25 3.7.5. Expander Registers ...........................................................................................................27 3.8. Output Effects ..................................................................................................................................28 3.9. Stereo Depth (3-D) Enhancement ...................................................................................................28 3.10. Psychoacoustic Bass Enhancement ..............................................................................................29 3.11. Treble Enhancement .....................................................................................................................30 3.12. Mute and De-Emphasis .................................................................................................................31 3.13. Mono Operation and Phase Inversion ...........................................................................................31 3.13.1. DAC Control Register .....................................................................................................31 3.13.2. Interpolation and Filtering ................................................................................................32 3.14. Analog Outputs ..............................................................................................................................33 3.14.1. Headphone Output ...........................................................................................................33 3.14.2. Speaker Outputs ..............................................................................................................34 TM 3.14.3. DDX Class D Audio Processing ....................................................................................34 3.15. Other Output Capabilities ..............................................................................................................39 3.15.1. Audio Output Control .......................................................................................................40 3.15.2. Headphone Switch ...........................................................................................................40 3.15.3. Headphone Operation ......................................................................................................41 3.15.4. EQ Operation ...................................................................................................................41 3.16. Thermal Shutdown .........................................................................................................................42 3.16.1. Algorithm description: ......................................................................................................42 3.16.2. Thermal Trip Points........................................................................................................42 3.16.3. Temperature Limit State Diagram: ...................................................................................43 3.16.4. Instant Cut Mode ..............................................................................................................43 3.16.5. Short Circuit Protection ....................................................................................................44 3.16.6. Thermal Shutdown Registers ...........................................................................................44 4. INPUT AUDIO PROCESSING ................................................................................................. 47 4.1. Analog Inputs ...................................................................................................................................47 4.1.1. Input Registers ...................................................................................................................48 4.2. Mono Mixing and Output Configuration ...........................................................................................48 4.2.1. ADC Registers ...................................................................................................................49 4.3. Microphone Bias ..............................................................................................................................50 4.3.1. Microphone Bias Control Register .....................................................................................50 4.4. Programmable Gain Control ............................................................................................................50 4.4.1. Input PGA Software Control Register..............................................................................51 2 V1.6 08/13 2011 INTEGRATED DEVICE TECHNOLOGY, INC. ACS422X00

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