X-On Electronics has gained recognition as a prominent supplier of 2101 Temperature Sensor Development Tools across the USA, India, Europe, Australia, and various other global locations. 2101 Temperature Sensor Development Tools are a product manufactured by Tinkerforge. We provide cost-effective solutions for Temperature Sensor Development Tools, ensuring timely deliveries around the world.

2101 Tinkerforge

2101 electronic component of Tinkerforge
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Part No.2101
Manufacturer: Tinkerforge
Category: Temperature Sensor Development Tools
Description: Temperature Sensor Development Tools PTC Bricklet 2.0: Reads temperatures from Pt100 und Pt1000 sensors
Datasheet: 2101 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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We are delighted to provide the 2101 from our Temperature Sensor Development Tools category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 2101 and other electronic components in the Temperature Sensor Development Tools category and beyond.

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SPC560B40x, SPC560B50x SPC560C40x, SPC560C50x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Datasheet - production data Up to 6 FlexCAN interfaces (2.0B active) with 64-message objects each Up to 4 LINFlex/UART 3 DSPI / I2C LQFP100 (14 x 14 x 1.4 mm) LQFP64 (10 x 10 x 1.4 mm) Single 5 V or 3.3 V supply LQFP144 (20 x 20 x 1.4 mm) 10-bit analog-to-digital converter (ADC) with up to 36 channels Features Extendable to 64 channels via external multiplexing High-performance 64 MHz e200z0h CPU Individual conversion registers 32-bit Power Architecture technology Cross triggering unit (CTU) Up to 60 DMIPs operation Variable length encoding (VLE) Dedicated diagnostic module for lighting Advanced PWM generation Memory Time-triggered diagnostic Up to 512 KB Code Flash with ECC PWM-synchronized ADC measurements 64 KB Data Flash with ECC Up to 48 KB SRAM with ECC Clock generation 8-entry memory protection unit (MPU) 4 to 16 MHz fast external crystal oscillator (FXOSC) Interrupts 32 kHz slow external crystal oscillator 16 priority levels (SXOSC) Non-maskable interrupt (NMI) 16 MHz fast internal RC oscillator (FIRC) Up to 34 external interrupts incl. 18 wakeup 128 kHz slow internal RC oscillator (SIRC) lines Software-controlled FMPLL GPIO: 45(LQFP64), 75(LQFP100), Clock monitor unit (CMU) 123(LQFP144) Timer units Exhaustive debugging capability 6-channel 32-bit periodic interrupt timers Nexus1 on all devices 4-channel 32-bit system timer module Nexus2+ available on emulation package Software watchdog timer (LBGA208) Real-time clock timer Low power capabilities 16-bit counter time-triggered I/Os Ultra-low power standby with RTC, SRAM Up to 56 channels with PWM/MC/IC/OC and CAN monitoring ADC diagnostic via CTU Fast wakeup schemes Communications interface Operating temp. range up to -40 to 125 C Table 1. Device summary Part number Package 256 KB code Flash memory 512 KB code Flash memory LQFP144 SPC560B40L5 SPC560B50L5 LQFP100 SPC560B40L3 SPC560C40L3 SPC560B50L3 SPC560C50L3 (1) LQFP64 SPC560B40L1 SPC560C40L1 SPC560B50L1 SPC560C50L1 1. All LQFP64information is indicative and must be confirmed during silicon validation. February 2015 DocID14619 Rev 13 1/116 This is information on a product in full production. www.st.comContents SPC560B40x/50x, SPC560C40x/50x Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3 Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2 Pad configuration during reset phases . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3 Voltage supply pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.4 Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.5 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.6 Functional ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.7 Nexus 2+ pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.8 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.9 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.10 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.11 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.11.1 NVUSRO[PAD3V5V] field description . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.11.2 NVUSRO[OSCILLATOR_MARGIN] field description . . . . . . . . . . . . . . . 41 3.11.3 NVUSRO[WATCHDOG_EN] field description . . . . . . . . . . . . . . . . . . . . 41 3.12 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.13 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 3.14 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.14.1 Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.14.2 Power considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.15 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.15.1 I/O pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.15.2 I/O input DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.15.3 I/O output DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 3.15.4 Output pin transition times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 3.15.5 I/O pad current specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 2/116 DocID14619 Rev 13

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