X-On Electronics has gained recognition as a prominent supplier of TC3567DFSG-002(E1C rf transceiver across the USA, India, Europe, Australia, and various other global locations. TC3567DFSG-002(E1C rf transceiver are a product manufactured by Toshiba. We provide cost-effective solutions for rf transceiver, ensuring timely deliveries around the world.

TC3567DFSG-002(E1C

TC3567DFSG-002(E1C electronic component of Toshiba
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Part No.TC3567DFSG-002(E1C
Manufacturer: Toshiba
Category:RF Transceiver
Description: RF Transceiver Bluetooth 4.2 IC 0dBm 3.6V 3.3mA
Datasheet: TC3567DFSG-002(E1C Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.4924 ea
Line Total: USD 1.49

Availability - 873
Ships to you between
Thu. 30 May to Wed. 05 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
873 - WHS 1


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 1
Multiples : 1
1 : USD 1.2978
10 : USD 1.2778
25 : USD 1.2577
50 : USD 1.2377
100 : USD 1.2177
250 : USD 1.1977
500 : USD 1.1777

     
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We proudly offer the TC3567DFSG-002(E1C RF Transceiver at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the TC3567DFSG-002(E1C RF Transceiver.

TC3567DFSG-002 TC3567DFSG-002 Bluetooth low energy IC Rev 1.2 The Bluetooth word mark and logos are registered trademarks owned by the BluetSootIGh, Inc. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. 2017-2018 1 2018-04-26 Toshiba Electronic Devices & Storage Corporation TC3567DFSG-002 Contents 1. General Description ...............................................................................................................................................................................4 1.1. Product Concept ...............................................................................................................................................................................4 1.2. Features .............................................................................................................................................................................................4 2. Pin Function ...........................................................................................................................................................................................6 2.1. TC3567DFSG Pin Assignment (Top View)......................................................................................................................................6 2.2. Pin Function Descriptions .................................................................................................................................................................7 2.3. GPIO function list ............................................................................................................................................................................ 10 2.4. Power Supply Pins ......................................................................................................................................................................... 12 3. System Configuration ......................................................................................................................................................................... 13 3.1. Block Diagram ................................................................................................................................................................................ 13 3.2. Boot Sequence ............................................................................................................................................................................... 14 4. Functional Specifications .................................................................................................................................................................... 15 4.1. Bluetooth Function ....................................................................................................................................................................... 15 4.1.1. Supported Function ........................................................................................................................................................... 15 4.1.2. Support Protocol Layer ...................................................................................................................................................... 16 4.1.3. RF ....................................................................................................................................................................................... 17 4.1.4. Auto Advertise Function ..................................................................................................................................................... 17 4.2. Reset Interface (Power up sequence) .......................................................................................................................................... 18 4.2.1. Features ............................................................................................................................................................................. 18 4.2.2. Connection Example ......................................................................................................................................................... 18 4.3. UART Interface ............................................................................................................................................................................... 19 4.3.1. Features ............................................................................................................................................................................. 19 4.3.2. Connection Example ......................................................................................................................................................... 19 4.3.3. Frame Format .................................................................................................................................................................... 20 4.3.4. Flow Control Function ........................................................................................................................................................ 20 4.3.5. Baud rate ........................................................................................................................................................................... 21 4.3.6. TX message spacing function ........................................................................................................................................... 21 4.3.7. Error Detecting Functions .................................................................................................................................................. 22 4.3.8. Host Wake up Function ..................................................................................................................................................... 23 4.3.9. HCI mode ........................................................................................................................................................................... 23 4.3.9.1. HCI Reset ...................................................................................................................................................................... 23 4.4. SPI Interface ................................................................................................................................................................................... 24 4.4.1. Features ............................................................................................................................................................................. 24 4.4.2. Connection Example ......................................................................................................................................................... 24 4.4.3. Frame Format .................................................................................................................................................................... 25 2 4.5. I C Interface .................................................................................................................................................................................... 26 4.5.1. Features ............................................................................................................................................................................. 26 4.5.2. Connection Example ......................................................................................................................................................... 26 4.5.3. Selection of External Pull-up Resistor Value .................................................................................................................... 27 4.5.4. Frame Format .................................................................................................................................................................... 28 4.6. PWM Interface ................................................................................................................................................................................ 29 4.6.1. Pulse Generation Function.............................................................................................................................................. 29 4.6.2. Rhythm Function (Output Masking) .................................................................................................................................. 30 4.7. ADC ................................................................................................................................................................................................ 31 4.7.1. Features ............................................................................................................................................................................. 31 4.7.2. Descriptions ....................................................................................................................................................................... 31 2 2018-04-26

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
TS4

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