TLP5752(E Toshiba

TLP5752 Photocouplers Infrared LED & Photo IC TLP5752TLP5752TLP5752TLP5752 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Induction Cooktop and Home Appliances Industrial Inverters Air Conditioner Inverters MOSFET Gate Drivers IGBT Gate Drivers 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP5752 consists of an infrared LED and integrated high-gain, high-speed photodetector and is house in the 6-pin SO6L package. The TLP5752 is 50 % smaller than the 8-pin DIP package and meets the reinforced insulation class requirements of international safety standards. Therefore the mounting area can be reduced in equipment requiring the safety standard certification. The TLP5752 has an internal faraday shield that provides a guaranteed common-mode transient immunity of 35 kV/s. In particular, the TLP5752 has rail to rail output, and this enables stable operation and better switching performance in system. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (totem pole output) (2) Output peak current: 2.5 A (max) (3) Operating temperature: -40 to 110 (4) Supply current: 3.0 mA (max) (5) Supply voltage: 15 to 30 V (6) Threshold input current: 4 mA (max) (7) Propagation delay time: t /t = 150 ns (max) pHL pLH (8) Common-mode transient immunity: 35 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Japan and Thailand Factory Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2014-06 2015-2019 2019-12-10 1 Toshiba Electronic Devices & Storage Corporation Rev.9.0TLP5752 4. 4. 4. 4. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP5752 TLP5752(LF4) 11-4N1A 11-4N101A Note: Lead forming option: (LF4) 5. Pin Assignment 5. 5. 5. Pin AssignmentPin AssignmentPin Assignment 1: Anode 2: N.C. 3: Cathode 4: GND 5: V (Output) O 6: V CC 6. 6. 6. 6. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 1-F bypass capacitor must be connected between pin 6 and pin 4. 2015-2019 2019-12-10 2 Toshiba Electronic Devices & Storage Corporation Rev.9.0