X-On Electronics has gained recognition as a prominent supplier of TE0725-03-35-2C System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0725-03-35-2C System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0725-03-35-2C Trenz Electronic

TE0725-03-35-2C electronic component of Trenz Electronic
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Part No.TE0725-03-35-2C
Manufacturer: Trenz Electronic
Category: System-On-Modules - SOM
Description: System-On-Modules - SOM FPGA Module with Xilinx Artix-7 XC7A35T-2CSG324C 2 x 50 Pin with 2.54 mm pitch
Datasheet: TE0725-03-35-2C Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Obsolete
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MOQ : 1
Multiples : 1
1 : USD 102.6092
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We are delighted to provide the TE0725-03-35-2C from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0725-03-35-2C and other electronic components in the System-On-Modules - SOM category and beyond.

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TE0725 TRM Revision: v.65 Exported on: 06/29/2018TE0725 TRM v.65 1 Table of Contents 1 Table of Contents............................................................................................................................................ 2 2 Overview.......................................................................................................................................................... 3 2.1 Key Features.................................................................................................................................................... 3 2.2 Block Diagram ................................................................................................................................................. 3 2.3 Main Components........................................................................................................................................... 3 3 Signals, Interfaces and Pins............................................................................................................................ 5 3.1 I/O Banks ......................................................................................................................................................... 5 3.2 JTAG Interface................................................................................................................................................. 5 3.3 POF Transceiver .............................................................................................................................................. 5 3.4 On-board LED s ............................................................................................................................................... 6 3.5 Connectors ...................................................................................................................................................... 6 4 Power and Power-On Sequence .................................................................................................................... 7 4.1 Power Supply .................................................................................................................................................. 7 4.2 Power Consumption ....................................................................................................................................... 7 4.3 Power-On Sequence ....................................................................................................................................... 7 5 Variants Currently In Production ................................................................................................................... 8 6 Technical Specifications................................................................................................................................. 9 6.1 Absolute Maximum Ratings............................................................................................................................ 9 6.2 Recommended Operating Conditions ........................................................................................................... 9 6.3 Physical Dimensions ....................................................................................................................................... 9 6.4 Operating Temperature Ranges................................................................................................................... 10 7 Revision History ............................................................................................................................................ 12 7.1 Hardware Revision History ........................................................................................................................... 12 7.2 Document Change History........................................................................................................................... 12 8 Disclaimer...................................................................................................................................................... 13 8.1 Data privacy .................................................................................................................................................. 13 8.2 Document Warranty...................................................................................................................................... 13 8.3 Limitation of Liability.................................................................................................................................... 13 8.4 Copyright Notice ........................................................................................................................................... 13 8.5 Technology Licenses..................................................................................................................................... 13 8.6 Environmental Protection ............................................................................................................................ 13 8.7 REACH, RoHS and WEEE ............................................................................................................................... 13 Copyright 2018Trenz Electronic GmbH 2 of 14

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:
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