CH www.vishay.com Vishay Sfernice High Frequency 50 GHz Thin Film Chip Resistor FEATURES Operating frequency 50 GHz Thin film microwave resistors SMD wraparound or flip chip resistor Small size, down to 20 mils by 16 mils Edged trimmed block resistors Pure alumina substrate (99.5 %) Ohmic range: 10R to 500R Design kits available -24 Small internal reactance (LC down to 1 10 ) Tolerance 1 %, 2 %, 5 %, 10 % TCR: 100 ppm/C in (-55 C, +155 C) temperature range Material categorization: for definitions of compliance Those miniaturized components are designed in such a way please see www.vishay.com/doc 99912 that their internal reactance is very small. When correctly mounted and utilized, they function as almost pure resistors on a very large range of frequency, up to 50 GHz. STANDARD ELECTRICAL SPECIFICATIONS LIMITING RESISTANCE RATED POWER TEMPERATURE ELEMENT TOLERANCE MODEL SIZE RANGE Pn COEFFICIENT VOLTAGE % W ppm/C V CH02016 02016 10 to 500 0.030 30 2, 5, 10 100 CH0402 0402 10 to 500 0.050 37 1, 2, 5, 10 100 CH0603 0603 10 to 500 0.125 50 1. 2, 5, 10 100 DIMENSIONS in millimeters (inches) (1) A A A D D D D D D C C C B E E (F) (P) (N) and (G) DIMENSIONS CASE SIZE (1) A BC D/E MAX. TOL. MAX. TOL. MAX. TOL. MAX. TOL. + 0.1 (+ 0.004) + 0.1 (+ 0.004) + 0.1 (+ 0.004) + 0.127 (+ 0.005) MIN. TOL. MIN. MAX. MIN. TOL. MIN. TOL. MIN. TOL. - 0.1 (- 0.004) - 0.1 (- 0.004) - 0.1 (- 0.004) - 0.127 (- 0.005) (2) 02016 0.48 (0.020) 0.39 (0.016) 0.42 (0.02) 0.11 (0.004) 0.15 (0.008) 0402 1.00 (0.040) 0.6 (0.023) 0.5 (0.02) 0.15 (0.006) 0.35 (0.014) 0603 1.52 (0.060) 0.75 (0.030) 0.5 (0.02) 0.25 (0.010) 0.51 (0.020) Notes (1) For CH0402 and CH0603 with P termination, A dimension is increased by 0.2 mm (2) + or - 0.07 mm Revision: 04-Apr-16 Document Number: 53014 1 For technical questions, contact: sferthinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000CH www.vishay.com Vishay Sfernice LAND PATTERN FLIP CHIP TERMINATIONS in millimeters G min. X max. Z max. CHIP SIZE Z X G max. max. min. 02016 0.53 0.44 0.15 0402 1.4 0.650 0.4 0603 1.71 0.9 0.760 Note Suggested land pattern: According to IPC-7351 Dimension and tolerance of land pattern shall be defined by PCB designer PCB can be designed according to IPC-7351A Generic Requirements for Surface Mount Design and Land Pattern Standard Example of land pattern: Fabrication allowance, assembly location and min. or max. level density board are not included in the exemple bellow. According to IPC-7351A Generic Requirements for Surface Mount Design and Land Pattern Standard: 2 2 2 Z = A + 2J + C ++F P with C: Unilateral profile tolerance for the component max. min. T A 2 2 2 G = F + 2J - C ++F P F: Unilateral profile tolerance for the board land pattern min. max. H F 2 2 2 X = B + 2J + C ++F P and P: Diameter of true position placement accuracy to the center of land pattern. max. min. S B For rectangular component Flip-Chip mounting, we J H suggest: J S JT (TOE) 0 mm JH (HELL) 0 mm COMPONENT JS (SDE) 0 mm J T Land Pattern Footprint WRAPAROUND TERMINATIONS in millimeters G min. Z max. CHIP SIZE Z G X max. min. max. 0402 1.55 0.15 0.73 0603 2.37 0.35 0.98 TOLERANCE VS. OHMIC VALUES Ohmic range 10 R < 50 50 R < 100 100 R 500 (1) Tolerance 5 %, 10 % 2 %, 5 %, 10 % 1 %, 2 %, 5 %, 10 % Note (1) 1 % tolerance not applicable for case 02016. Revision: 04-Apr-16 Document Number: 53014 2 For technical questions, contact: sferthinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 X max.