X-On Electronics has gained recognition as a prominent supplier of HSF-48-30-B-F heat sinks across the USA, India, Europe, Australia, and various other global locations. HSF-48-30-B-F heat sinks are a product manufactured by Wakefield. We provide cost-effective solutions for heat sinks, ensuring timely deliveries around the world.

HSF-48-30-B-F

HSF-48-30-B-F electronic component of Wakefield
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Part No.HSF-48-30-B-F
Manufacturer: Wakefield
Category:Heat Sinks
Description: Heat Sinks Heatsink Fan Combination 47.5x47.5mm 5.9CFM 29.5mm Height 0.83 CW
Datasheet: HSF-48-30-B-F Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 60.1692 ea
Line Total: USD 60.17

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 05 Jun to Fri. 07 Jun

MOQ : 1
Multiples : 1
1 : USD 54.9164
10 : USD 52.2502
25 : USD 49.7835
50 : USD 46.4696

0 - WHS 2


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 1
Multiples : 1
1 : USD 65.0622

     
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We proudly offer the HSF-48-30-B-F Heat Sinks at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the HSF-48-30-B-F Heat Sinks.

Heat Sink Fan Combinations HSF Series Wakefield-Vettes Heat Sink Fan Series (HSF) are for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, Cloud Computing, and many more Industries. Material: AL 6063 Finish: Black Anodize Series- Chip Size- Height- Chip Height- Fan 48 B-Blue (2.2-3.4mm) F (Fan) HSF mm 50 Y- Yellow (.9-2.1mm) N (No Fan) 55 WKV Part Number Chip Size Height (mm) C/W Chip Height Fan HSF-48-19-B-F 47.5 x 47.5mm 18.5 1.41 2.2-3.4mm 5.9CFM HSF-48-19-Y-F 47.5 x 47.5mm 18.5 1.41 .9-2.1mm 5.9CFM HSF-48-22-B-F 47.5 x 47.5mm 21.5 1.14 2.2-3.4mm 5.9CFM HSF-48-22-Y-F 47.5 x 47.5mm 21.5 1.14 .9-2.1mm 5.9CFM HSF-48-25-B-F 47.5 x 47.5mm 24.5 0.98 2.2-3.4mm 5.9CFM HSF-48-25-Y-F 47.5 x 47.5mm 24.5 0.98 .9-2.1mm 5.9CFM HSF-48-28-B-F 47.5 x 47.5mm 27.5 0.88 2.2-3.4mm 5.9CFM HSF-48-28-Y-F 47.5 x 47.5mm 27.5 0.88 .9-2.1mm 5.9CFM HSF-48-30-B-F 47.5 x 47.5mm 29.5 0.83 2.2-3.4mm 5.9CFM HSF-48-30-Y-F 47.5 x 47.5mm 29.5 0.83 .9-2.1mm 5.9CFM HSF-48-35-B-F 47.5 x 47.5mm 34.5 0.77 2.2-3.4mm 5.9CFM HSF-48-35-Y-F 47.5 x 47.5mm 34.5 0.77 .9-2.1mm 5.9CFM HSF-48-40-B-F 47.5 x 47.5mm 39.5 0.72 2.2-3.4mm 5.9CFM HSF-48-40-Y-F 47.5 x 47.5mm 39.5 0.72 .9-2.1mm 5.9CFM HSF-50-19-B-F 50 x 50mm 18.5 1.31 2.2-3.4mm 5.9CFM HSF-50-19-Y-F 50 x 50mm 18.5 1.31 .9-2.1mm 5.9CFM HSF-50-22-B-F 50 x 50mm 21.5 1.06 2.2-3.4mm 5.9CFM HSF-50-22-Y-F 50 x 50mm 21.5 1.06 .9-2.1mm 5.9CFM HSF-50-25-B-F 50 x 50mm 24.5 0.91 2.2-3.4mm 5.9CFM HSF-50-25-Y-F 50 x 50mm 24.5 0.91 .9-2.1mm 5.9CFM HSF-50-28-B-F 50 x 50mm 27.5 0.82 2.2-3.4mm 5.9CFM HSF-50-28-Y-F 50 x 50mm 27.5 0.82 .9-2.1mm 5.9CFM HSF-50-30-B-F 50 x 50mm 29.5 0.77 2.2-3.4mm 5.9CFM HSF-50-30-Y-F 50 x 50mm 29.5 0.77 .9-2.1mm 5.9CFM HSF-50-35-B-F 50 x 50mm 34.5 0.71 2.2-3.4mm 5.9CFM HSF-50-35-Y-F 50 x 50mm 34.5 0.71 .9-2.1mm 5.9CFM HSF-50-40-B-F 50 x 50mm 39.5 0.67 2.2-3.4mm 5.9CFM HSF-50-40-Y-F 50 x 50mm 39.5 0.67 .9-2.1mm 5.9CFM HSF-55-24-B-F 55 x 55mm 24.1 1 2.2-3.4mm 13.8CFM HSF-55-24-Y-F 55 x 55mm 24.1 1 .9-2.1mm 13.8CFM HSF-55-27-B-F 55 x 55mm 27.1 0.81 2.2-3.4mm 13.8CFM HSF-55-27-Y-F 55 x 55mm 27.1 0.81 .9-2.1mm 13.8CFM HSF-55-30-B-F 55 x 55mm 30.1 0.7 2.2-3.4mm 13.8CFM HSF-55-30-Y-F 55 x 55mm 30.1 0.7 .9-2.1mm 13.8CFM HSF-55-33-B-F 55 x 55mm 33.1 0.63 2.2-3.4mm 13.8CFM HSF-55-33-Y-F 55 x 55mm 33.1 0.63 .9-2.1mm 13.8CFM HSF-55-35-B-F 55 x 55mm 35.1 0.59 2.2-3.4mm 13.8CFM HSF-55-35-Y-F 55 x 55mm 35.1 0.59 .9-2.1mm 13.8CFM HSF-55-40-B-F 55 x 55mm 40.1 0.55 2.2-3.4mm 13.8CFM HSF-55-40-Y-F 55 x 55mm 40.1 0.55 .9-2.1mm 13.8CFM HSF-55-45-B-F 55 x 55mm 45.1 0.51 2.2-3.4mm 13.8CFM HSF-55-45-Y-F 55 x 55mm 45.1 0.51 .9-2.1mm 13.8CFM www.wakefield-vette.comHeat Sink Fan Combinations HSF Series Chip Size 47.5x 47.5mm Chip Size 50 x 50mm Chip Size 55 x 55mm

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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