CLEO-RIO1

CleO- RIO Module Datasheet Version 1.0 Document Reference No.: FT 001310 C learance No.: FTDI 495 Future Technology Devices International Limited Datasheet CleO-RIO Module 1 Introduction The CleO-RIO module is an Arduino shield adapter board giving users the flexibility to stack their Arduino board on top of the CleO35 module- the smart TFT Display. The module is a two layer PCB with dimensions of 57.15mm X 54.35mm 2 Ordering Information Part No. Description CleO-RIO1 CleO-Reverse I/O adapter board Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, C enturion Business Park, Glasgow G41 1HH United Kingdom. Scotland Registered C ompany Number: SC 136640 Copyright Future Technology Devices International Limited 1 CleO- RIO Module Datasheet Version 1.0 Document Reference No.: FT 001310 C learance No.: FTDI 495 Table of Contents 1 Introduction ................................................................. 1 2 Ordering Information .................................................... 1 3 Pin Out and Signal Description ...................................... 3 3.1 Module Description ................................................................ 3 3.2 Module Signal Description ...................................................... 4 4 Board Schematic ........................................................... 6 5 Mechanical Dimensions ................................................. 7 6 Contact Information ...................................................... 8 Appendix A References ................................................... 9 Acronyms and Abbreviations .......................................................... 9 Appendix B - List of Figures and Tables ............................ 10 List of Tables ................................................................................10 List of Figures ...............................................................................10 Appendix C Revision History.......................................... 11 Copyright Future Technology Devices International Limited 2