EVALUATION KIT AVAILABLE MAX11166 16-Bit, 500ksps, 5V SAR ADC with Internal Reference in TDFN General Description Benefits and Features The MAX11166 16-bit, 500ksps, SAR ADC offers excel- High DC/AC Accuracy Improves Measurement lent AC and DC performance with true bipolar input range, Quality small size, and internal reference. The MAX11166 mea- 16-Bit Resolution with No Missing Codes sures a Q5V (10V ) input range while operating from P-P 500ksps Throughput Rates Without Pipeline Delay/ a single 5V supply. A patented charge-pump architecture Latency allows direct sampling of high-impedance sources. The 92.9dB SNR and -103dB THD at 10kHz MAX11166 integrates an optional internal reference and 0.5 LSB Transition Noise RMS buffer, saving additional cost and space. 0.2 LSB DNL (typ) and 0.4 LSB INL (typ) This ADC achieves 92.9dB SNR and -103dB THD. The Highly Integrated ADC Saves Cost and Space MAX11166 guarantees 16-bit no-missing codes and Q0.4 6ppm/C Internal Reference LSB INL (typ). Internal Reference Buffer The MAX11166 communicates using an SPI-compatible 5V Bipolar Analog Input Range serial interface at 2.5V, 3V, 3.3V, or 5V logic. The serial Wide Supply Range and Low Power Simplify Power- interface can be used to daisy-chain multiple ADCs in Supply Design parallel for multichannel applications and provides a busy 5V Analog Supply indicator option for simplified system synchronization and 2.3V to 5V Digital Supply timing. 25.5mW Power Consumption at 500ksps The MAX11166 is offered in a 12-pin, 3mm x 3mm, TDFN 10A in Shutdown Mode package and is specified over the -40NC to +85NC tem- Multi-Industry Standard Serial Interface and Small perature range. Package Reduce Size Applications SPI/QSPI/MICROWIRE/DSP-Compatible Data Acquisition Systems Serial Interface 3mm x 3mm Tiny 12-Pin TDFN Package Industrial Control Systems/Process Control Medical Instrumentation QSPI is a trademark of Motorola, Inc. MICROWIRE is a registered trademark of National Automatic Test Equipment Semiconductor Corporation. Selector Guide and Ordering Information appear at end of Typical Operating Circuit data sheet. VDD VOVDD 14-Bit to 18-Bit SAR ADC Family (5V) (2.3V TO 5V) 1F 1F 14-BIT 16-BIT 16-BIT 18-BIT 500ksps 250ksps 500ksps 500ksps 10 AIN+ SCLK 5V Input MAX9632 MAX11167 MAX11166 MAX11156 INTERFACE DIN 5V Internal 16-BIT ADC HOST AND MAX11169 MAX11168 MAX11158 AIN- DOUT C Reference CONTROL CNVST 0 to 5V Input 4.7nF MAX11161 MAX11160 MAX11150 MAX11166 Internal MAX11165 MAX11164 MAX11154 Reference REF INTERNAL REF REFERENCE 0 to 5V Input 10F BUF REFIO External MAX11262 MAX11163 MAX11162 MAX11152 0.1F AGNDS GND Reference 19-7673 Rev 0 7/15MAX11166 16-Bit, 500ksps, 5V SAR ADC with Internal Reference in TDFN Absolute Maximum Ratings V to GND ............................................................-0.3V to +6V Continuous Power Dissipation (T = +70NC) DD A OVDD to GND ....... -0.3V to the lower of (V + 0.3V) and +6V TDFN (derate 18.2mW/NC above +70NC) ..................1349mW DD AIN+ to GND ........................................................................Q7V Operating Temperature Range ........................... -40NC to +85NC AIN-, REF, REFIO, AGNDS Junction Temperature ......................................................+150NC to GND ............... -0.3V to the lower of (V + 0.3V) and +6V Storage Temperature Range ............................ -65NC to +150NC DD SCLK, DIN, DOUT, CNVST Lead Temperature (soldering, 10s) .................................+300NC to GND ............... -0.3V to the lower of (V + 0.3V) and +6V Soldering Temperature (reflow) .......................................+260NC DD Maximum Current into Any Pin...........................................50mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TDFN Junction-to-Ambient Thermal Resistance ( q ).......59.3NC/W JA Junction-to-Case Thermal Resistance ( q ) ...........22.5NC/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 4.75V to 5.25V, V = 2.3V to 5.25V, f = 500ksps, V = 4.096V Reference Mode 3, T = T to T , unless DD OVDD SAMPLE REF A MIN MAX otherwise noted. Typical values are at T = +25NC.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ANALOG INPUT (Note 3) 5.000 Input Voltage Range AIN+ to AIN-, K = -K x V +K x V V REF REF 4.096 -(V + +(V + DD DD AIN+ to GND 0.1) 0.1) Absolute Input Voltage Range V AIN- to GND -0.1 +0.1 Input Leakage Current Acquisition phase -10 +0.001 +10 A Input Capacitance 16 pF Input-Clamp Protection Current Both inputs -20 +20 mA DC ACCURACY (Note 4) Resolution N 16 Bits No Missing Codes 16 Bits Offset Error -7.5 0.8 +7.5 LSB Offset Temperature Coefficient 0.006 LSB/C Gain Error -4.3 1.2 +4.3 LSB Gain Error Temperature 0.015 LSB/C Coefficient Integral Nonlinearity INL T = T to T -1.2 0.4 +1.2 LSB A MIN MAX Differential Nonlinearity DNL Guaranteed by design -0.5 0.2 +0.5 LSB Positive Full-Scale Error -8 +8 LSB Maxim Integrated 2 www.maximintegrated.com