MAX4951AE 19-4812 Rev 0 7/09 SATA I/II Bidirectional Redriver with High ESD and Cable Detect General Description Features The MAX4951AE dual-channel buffer is designed to S Single +3.3V (typ) Supply Operation redrive serial-ATA (SATA) I and SATA II signals and S Low-Power, 350A (typ) eSATA Cable Detect can survive ESD events up to Q8kV Human Body Model S Supports SATA 1.5Gbps and 3.0Gbps Data Rates (HBM). The MAX4951AE can be placed near an eSATA connector to overcome board losses and produce an S Meets SATA I, SATA II Input/Output-Return Loss Mask eSATA-compliant signal level. This device is Serial ATA Revision 2.6 (gold standard)-compliant, while overcom- S Exceeds eSATA Standard Compliant Eye Mask for ing losses in the PCB and eSATA connector. Jitter The MAX4951AE features low standby current for power- S Meets or Exceeds eSATA Standard Compliant Eye sensitive applications. This device features hardware Mask for Output Levels SATA-drive cable detection, keeping the power low in S Supports SATA OOB Signaling standby mode. S Internal Input/Output 50I Termination Resistors The MAX4951AE preserves signal integrity at the receiv- S Inline Signal Traces for Flow-Through Layout er by reestablishing full output levels. It reduces the total system jitter (T ) by squaring up the signal and providing J S Pin Compatible with MAX4951 excellent return loss match to the source. This device S Space-Saving, 4mm x 4mm, TQFN Package features channel-independent digital boost controls S ESD Protection on All Pins: 8kV (HBM) to drive SATA outputs over normal trace lengths and eSATA connector. SATA Out-Of-Band (OOB) signaling is supported using high-speed amplitude detection on Ordering Information the inputs, and squelch on the corresponding outputs. PART TEMP RANGE PIN-PACKAGE Inputs and outputs are all internally 50I terminated. MAX4951AECTP+ 20 TQFN-EP* 0NC to +70NC The MAX4951AE operates from a single +3.3V (typ) +Denotes a lead(Pb)-free/RoHS-compliant package. supply and is available in a small, 4mm x 4mm, TQFN *EP = Exposed pad. package with flow-through traces for ease of layout. This device is specified over the 0NC to +70NC operating Pin Configuration temperature range. Applications TOP VIEW Laptop Computers 15 14 13 12 11 Docking Stations Desktop Computers V 10 V CC 16 CC Servers BA GND 17 9 Data Storage/Work Stations MAX4951AE CAD 18 8 BB GND 19 7 EN *EP + V 20 6 V CC CC 1 2 3 4 5 TQFN (4mm 4mm) *CONNECT EXPOSED PAD (EP) TO GND. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. HAP DAP HAM DAM GND GND DBM HBM DBP HBPSATA I/II Bidirectional Redriver with High ESD and Cable Detect ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to GND.) Continuous Power Dissipation (T = +70NC) A V ...................................................................... -0.3V to +4.0V 20-Pin TQFN (derate 25.6mW/NC above +70NC) ..... 2051mW CC HAP, HAM, DBP, DBM, EN, Junction-to-Case Thermal Resistance (B ) (Note 2) JC CAD, BA, BB (Note 1) ......................... -0.3V to (V + 0.3V) 20-Pin TQFN ................................................................ 6NC/W CC Short-Circuit Output Current Junction-to-Ambient Thermal Resistance (B ) (Note 2) JA (HBP, HBM, DAP, DAM) ............................................. Q30mA 20-Pin TQFN .............................................................. 39NC/W Continuous Current at Inputs Operating Temperature Range ........................... 0NC to +70NC (HAP, HAM, DBP, DBM) ............................................... Q5mA Storage Temperature Range ......................... -55NC to +150NC Continuous Current Lead Temperature (soldering, 10s) ...............................+300NC (EN, CAD, BA, BB) ........................................................ Q5mA Note 1: All I/O pins are clamped by internal diodes. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +3.0V to +3.6V, C = 10nF, R = 50I, T = 0NC to +70NC, unless otherwise noted. Typical values are at V = +3.3V, CC L L A CC T = +25NC.) (Note 3) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Power-Supply Range V 3.0 3.6 V CC BA = BB = V 75 100 CC Operating Supply Current I mA CC BA = BB = GND 70 90 Power-Down Supply Current I 0.35 2 mA PWDN EN = GND or CAD = V CC Differential Input Resistance Z 85 100 115 I RX-DIFF-DC Differential Output Resistance Z 85 100 115 I TX-DIFF-DC AC PERFORMANCE f = 150MHz to 300MHz -18 f = 300MHz to 600MHz -14 Differential Input Return Loss RL f = 600MHz to 1200MHz -10 dB RX-DIFF (Note 4) f = 1.2GHz to 2.4GHz -8 f = 2.4GHz to 3.0GHz -3 f = 150MHz to 300MHz -5 f = 300MHz to 600MHz -5 Common-Mode Input Return RL f = 600MHz to 1200MHz -2 dB RX-CM Loss (Note 4) f = 1.2GHz to 2.4GHz -2 f = 2.4GHz to 3.0GHz -2 f = 150MHz to 300MHz -14 f = 300MHz to 600MHz -8 Differential Output Return Loss RL f = 600MHz to 1200MHz -6 dB TX-DIFF (Note 4) f = 1.2GHz to 2.4GHz -6 f = 2.4GHz to 3.0GHz -3 2 MAX4951AE