Hardware Features Chip Type Industrial Grade Standard Grade Supplier Starchip Samsung Chip Codes SCM392G S3FS9FG Electrical Characteristics 1.6V to 5.5V 1.6V, 3V and 5V Operational Temperature Characteristics -40 to 105C -25 to 85C Memory Size available for program and data 136K/256K 340K/440K NVRAM characteristics Endurance cycles (min) 25 Min. 200MM read/write cycle Min. 500K read/write cycle Data retention (min) 25 25 Years 25 Years Vibration Passes JESD22-B103 Sector/Bank erase time 1.5ms/3ms 1.5ms/3ms Page write/erase time 1.5ms/0.4ms 1.5ms/0.4ms Software Features Platform Technology 2G/3G/4G/LTE 2G/3G/4G/LTE UICC Release 8 Release 8 Java Card 2.2.1 or higher 2.2.1 or higher Global Platform 2.2.1 2.2.1 Supported Applications SIM Release 4 Release 4 USIM Release 8 Release 8 ISIM Release 8 Release 8 HPSIM Release 8 OTA Capabilities Remote File Management Release 8 Release 8 Remote Applet Management Release 8 Release 8 SIM Card Physical Characteristics Embedded Form Factor (MFF2) Module Format MFF2 (QFN8) embedded. Size 6 x 5mm*, (height: 0.75-0.82mm) Standard TS 102.671 - standardized format Fitting Soldered to circuit board Transportation On trays/reels/boxes Technical Details (MFF2)SIM Card Physical Characteristics 2FF - Mini SIM 3FF - Micro SIM 4FF - Nano SIM Height: 25mm Height: 15mm Height: 12.3mm Width: 15mm Width: 12mm Width: 8.8mm Thickness: 0.76mm Thickness: 0.76mm Thickness: 0.67mm