X-On Electronics has gained recognition as a prominent supplier of MII300-12A4 discrete semiconductor modules across the USA, India, Europe, Australia, and various other global locations. MII300-12A4 discrete semiconductor modules are a product manufactured by IXYS. We provide cost-effective solutions for discrete semiconductor modules, ensuring timely deliveries around the world.

MII300-12A4 IXYS

MII300-12A4 electronic component of IXYS
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Part No.MII300-12A4
Manufacturer: IXYS
Category:Discrete Semiconductor Modules
Description: IXYS Discrete Semiconductor Modules IGBT MODULE 1200V,300A
Datasheet: MII300-12A4 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 148.1282 ea
Line Total: USD 148.13

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 11 Jun to Thu. 13 Jun

MOQ : 1
Multiples : 1
1 : USD 148.1282
5 : USD 143.0171

0 - WHS 2


Ships to you between Wed. 05 Jun to Tue. 11 Jun

MOQ : 1
Multiples : 1
1 : USD 278.642

     
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We are delighted to provide the MII300-12A4 from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MII300-12A4 and other electronic components in the Discrete Semiconductor Modules category and beyond.

MII 300-12A4 MID 300-12A4 MDI 300-12A4 I = 330 A C25 IGBT Modules V = 1200 V CES Short Circuit SOA Capability V = 2.2 V CE(sat) typ. Square RBSOA MII 300-12A4 MID 300-12A4 MDI 300-12A4 11 10 3 3 3 9 T1 T1 8 D1 D1 D11 3 8 2 8 1 1 9 1 1 9 T2 T2 D2 D12 D2 11 11 E72873 10 2 10 2 2 Features IGBTs T1 - T2 NPT IGBT technology Symbol Conditions Maximum Ratings low switching losses V T = 25C to 150C 1200 V CES VJ switching frequency up to 30 kHz square RBSOA, no latch up V 20 V GES high shor t circuit capability I T = 25C 330 A C25 C positive temperature coefficient for I T = 80C 220 A C80 C easy parallelling MOS input, voltage controlled I V = 15 V R = 3.3 T = 125C 400 A CM GE G VJ ultra fast free wheeling diodes V RBSOA Clamped inductive load L = 100 H V CEK CES package with DCB ceramic base plate t V = V V = 15 V R = 3.3 10 s SC CE CES GE G isolation voltage 4800 V (SCSOA) T = 125C non-repetitive VJ UL registered E72873 P T = 25C 1380 W tot C Advantages Symbol Conditions Characteristic Values space and weight savings (T = 25C, unless otherwise specified) VJ reduced protection circuits min. typ. max. Applications V I = 200 A V = 15 V 2.2 2.7 V CE(sat) C GE AC and DC motor control V I = 8 mA V = V 4.5 6.5 V GE(th) C GE CE AC ser vo and robot dr ives power supplies I V = V V = 0 V T = 25C 13 mA CES CE CES GE VJ welding inver ters T = 125C 20 mA VJ I V = 0 V V = 20 V 800 nA GES CE GE t 100 ns d(on) t 60 ns r Inductive load T = 125C VJ t 600 ns d(off) V = 600 V I = 200 A CE C t 90 ns f V = 15 V R = 3.3 GE G E 32 mJ on E 29 mJ off C 13 nF ies C V = 25 V V = 0 V f = 1 MHz 2 nF oes CE GE C 1 nF res R (per IGBT) 0.09 K/W thJC R with heatsink compound 0.18 K/W thJH IXYS reserves the right to change limits, test conditions and dimensions. 20090812a 2009 IXYS All rights reserved 1 - 4MII 300-12A4 MID 300-12A4 MDI 300-12A4 Free wheeling diodes D1 - D2 / D11 - D12 Equivalent Circuits for Simulation Symbol Conditions Maximum Ratings Conduction I T = 25C 450 A F25 C I T = 80C 280 A F80 C I R Symbol Conditions Characteristic Values 0 V min. typ. max. 0 V I = 300 A V = 0 V T = 25C 2.2 2.5 V F F GE VJ IGBT (typ. at V = 15 V T = 125C) GE J T = 125C 1.7 V VJ V = 1.3 V R = 6.2 m 0 0 I I = 200 A di /dt = -1800 A/s 180 A RM F F t V = 600 V V = 0 V T = 125C 200 ns rr R GE VJ Free wheeling diode (typ. at T = 125C) J V = 1.3 V R = 2.4 m R (per IGBT) 0.15 K/W 0 0 thJC R with heatsink compound 0.3 K/W thJH Module Symbol Conditions Maximum Ratings T operating -40...+150 C VJ T -40...+150 C stg V I < 1 mA 50/60 Hz 4000 V~ ISO ISOL M Mounting torque (module, M6) 2.25 - 2.75 Nm d (ter minal, M5) 2.5 - 3.7 Nm Symbol Conditions Characteristic Values min. typ. max. d Creepage distance on surface 10 mm S 9.6 d Str ike distance in air mm A Weight 250 g Dimensions in mm (1 mm = 0.0394 ) IXYS reserves the right to change limits, test conditions and dimensions. 20090812a 2009 IXYS All rights reserved 2 - 4

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
CLR
IXS
IXYS
IXYS CORP
Ixys Corporation
IXYS INTEG.CIRCUITS DIV(CLARE)
IXYS Integrated Circuits
IXYS Integrated Circuits / Clare
IXYS Integrated Circuits Division
IXYS Integrated Circuits/Clare
IXYS RF
IXYS SEMICONDUCTOR

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