Product Information

ATWINC1500-MR210PB1140

ATWINC1500-MR210PB1140 electronic component of Microchip

Datasheet
WiFi Modules (802.11) SmartConnect ATWINC1500B-MU-T Mod
Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

88: USD 8.2686 ea
Line Total: USD 727.64

0 - Global Stock
MOQ: 88  Multiples: 88
Pack Size: 88

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Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 88
Multiples : 88
88 : USD 9.1818

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Additional Infomation About Product

ATWINC15x0 ATWINC15x0-MR210xB IEEE 802.11 b/g/n SmartConnect IoT Module Introduction The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things) module, specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA), Low-Noise Amplifier (LNA), Switch, Power Management and a printed antenna or a micro co-ax (U.FL) connector for an external antenna resulting in a small form factor (21.7 x 14.7 x 2.1 mm) design. It is interoperable with various vendors 802.11 b/g/n access points. This module provides Serial Peripheral Interface (SPI) ports to interface with a host controller. The references to the ATWINC15x0-MR210xB module include the module devices listed in the following: ATWINC1500-MR210PB ATWINC1500-MR210UB ATWINC1510-MR210PB ATWINC1510-MR210UB Features IEEE 802.11 b/g/n 20 MHz (1x1) solution Single spatial stream in 2.4 GHz ISM band Integrated Transmit/Receive switch Integrated PCB antenna or U.FL micro co-ax connector for external antenna Superior sensitivity and range via advanced PHY signal processing Advanced equalization and channel estimation Advanced carrier and timing synchronization Wi-Fi Direct (supported till firmware release 19.5.2) Soft-AP support Supports IEEE 802.11 WEP, WPA, WPA2 security (1) Support Enterprise security with WPA/WPA2 (802.1X) EAP-TLS EAP-PEAPv0/1 with TLS EAP-TTLSv0 with MSCHAPv2 EAP-PEAPv0/1 with MSCHAPv2 Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment On-chip memory management engine to reduce host load SPI host interface o Operating temperature range from -40C to +85C. RF performance at room temperature of 25 C with a 2-3 dB change at boundary conditions Power supply for I/O (VDDIO) rages from 2.7V to 3.6V Power supply for DC/DC converter (VBAT) ranges from 3.0V to 4.2V Built-in 26 MHz crystal Integrated Flash memory for system software Datasheet DS70005304E-page 1 2015-2021 Microchip Technology Inc. ATWINC15x0 Power Save modes 4 A Power-Down mode typical at 3.3V I/O (2) 380 A Doze mode with chip settings preserved (used for beacon monitoring) On-chip low power sleep oscillator Fast host wake-up from Doze mode by a pin or SPI transaction Fast Boot options On-chip boot ROM (Firmware instant boot) SPI flash boot Low-leakage on-chip memory for state variables Fast AP re-association (150 ms) On-chip Network stack to offload MCU Network features TCP, UDP, DHCP, ARP, HTTP, TLS and DNS Hardware accelerators for Wi-Fi and TLS security to improve connection time Hardware accelerator for IP checksum Hardware accelerators for OTA security Small footprint host driver Wi-Fi Alliance certifications for Connectivity and Optimizations ID: WFA61069 Notes: 1. For more information on the software features, refer to the Wi-Fi Network Controller Software Design Guide at ww1.microchip.com/downloads/en/DeviceDoc/00002389A.pdf. 2. For more information on the module power modes, refer to 7. Power Consumption. DS70005304E-page 2 Datasheet 2015-2021 Microchip Technology Inc.

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

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