Product Information

BGA6589,135

BGA6589,135 electronic component of NXP

Datasheet
RF Wireless Misc MMIC AMPLIFIER
Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 1.8346
10 : USD 1.6611
25 : USD 1.4832
100 : USD 1.3349
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1
1 : USD 1.0079
10 : USD 1.0019
100 : USD 0.9657
250 : USD 0.9235
1000 : USD 0.8812
N/A

Obsolete
0 - WHS 3

MOQ : 1
Multiples : 1
1 : USD 2.9763
10 : USD 1.0904
100 : USD 0.8919
500 : USD 0.8477
1000 : USD 0.7708
4000 : USD 0.7697
8000 : USD 0.74
48000 : USD 0.7174
N/A

Obsolete

Read More Specifications

     
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Additional Infomation About Product

BGA6589 MMIC wideband medium power amplifier Rev. 3 28 November 2011 Product data sheet 1. Product profile 1.1 General description The BGA6589 is a silicon Monolithic Microwave Integrated Circuit (MMIC) wideband medium power amplifier with internal matching circuit in a 3-pin SOT89 plastic low thermal resistance SMD package. The BGA6x89 series of medium power gain blocks are resistive feedback Darlington configured amplifiers. Resistive feedback provides large bandwidth with high accuracy. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Broadband 50 gain block 20 dBm output power SOT89 package Single supply voltage needed 1.3 Applications Broadband medium power gain blocks Small signal high linearity amplifiers Variable gain and high output power in combination with the BGA2031 Cellular, PCS and CDPD IF/RF buffer amplifier Wireless data SONET Oscillator amplifier, final PA Drivers for CATV amplifierBGA6589 NXP Semiconductors MMIC wideband medium power amplifier 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V DC device voltage on pin 1 I = 81 mA - 4.8 - V D S I DC supply current V = 9 V R = 51 -81 - mA S S bias T = 25 C j 2 s insertion power gain f = 1950 MHz - 17 - dB 21 NF noise figure f = 1950 MHz - 3.3 - dB P load power at 1 dB gain f = 850 MHz - 21 - dBm L1dB compression f = 1950 MHz - 20 - dBm 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 RF OUT/BIAS 2GND 3 1 3RF IN 2 sym130 321 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGA6589 SC-62 plastic surface-mounted package collector pad for SOT89 good heat transfer 3 leads 4. Marking Table 4. Marking codes Type number Marking code BGA6589 5A BGA6589 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 28 November 2011 2 of 14

HS Compliance

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:

NXP may also be referenced as

FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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