NX5P2190 Logic controlled high-side power switch Rev. 1.1 15 January 2015 Product data sheet 1. General description The NX5P2190 is an advanced power switch with adjustable current limit. It includes under-voltage and over-voltage lockout, over-current, over-temperature, reverse bias and in-rush current protection circuits. These circuits are designed to isolate a voltage source from a VBUS interface pin automatically when a fault occurs. The device features two power switch terminals, one input (VINT) and one output (VBUS). A current limit input (ILIM) defines the over-current and in-rush current limit, and a voltage detect output (VDET) monitors the voltage level on VBUS. An open-drain fault output (FAULT) indicates when a fault condition occurs. An enable input (EN) controls the state of the switch. When EN is set LOW the device enters a low-power mode, disabling all protection circuits except the under-voltage lockout. The low-power mode can be entered at anytime unless the over temperature protection circuit has been triggered. Designed for operation from 3 V to 5.5 V, the NX5P2190 is a complete solution for power domain isolation and protection applications. The enable input includes integrated logic level translation making the device compatible with lower voltage processors and controllers. 2. Features and benefits Wide supply voltage range from 3 V to 5.5 V 30 V tolerant on VBUS I maximum 2 A continuous current SW Very low ON resistance: 100 m (maximum) at a supply voltage of 4.0 V Low-power mode (ground current 20 A typical) 1.8 V control logic Soft start turn-on slew rate Protection circuitry Over-temperature protection Over-current protection with low current output mode Reverse bias current/Back drive protection Over-voltage lockout Under-voltage lockout Analog voltage limited VBUS monitor path ESD protection: HBM JDS-001 Class 2 exceeds 2 kV IEC61000-4-2 contact discharge exceeds 8 kV for pins VBUS Specified from 40 C to +85 CNX5P2190 NXP Semiconductors Logic controlled high-side power switch 3. Applications USB OTG applications 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version NX5P2190UK 40 C to +85 C WLCSP9 wafer level chip-scale package 9 bumps NX5P2190UK body 1.36 x 1.36 x 0.51 mm. (Backside coating included) 5. Marking Table 2. Marking codes Type number Marking code NX5P2190UK NX5PC 6. Functional diagram ( 1 9%86 9 ,17 9 7 ( ,/ 7 8/ DDD Fig 1. Logic symbol NX5P2190 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 1.1 15 January 2015 2 of 20 ) ,0