NX5P3001 Bidirectional high-side power switch for charger and USB-OTG combined applications Rev. 1 11 September 2013 Product data sheet 1. General description The NX5P3001 is an advanced bidirectional power switch and ESD-protection device for combined USB-OTG and charger port applications. It includes undervoltage lockout, overvoltage lockout and overtemperature protection circuits designed to automatically isolate the power switch terminals when a fault condition occurs. The device features two power switch input/output terminals (VBUSI and VBUSO), an open-drain acknowledge output (ACK), an enable input which includes logic level translation (EN) and low capacitance Transient Voltage Suppression (TVS) type ESD-clamps for USB data and ID pins. When EN is set HIGH the device enters a low-power mode, disabling all protection circuits. When used in combined charger and USB-OTG applications the 30 V tolerant VBUSI switch terminal is used as the supply and switch input when charging, for USB-OTG the VBUSO switch terminal is used as the supply and switch input. Designed for operation from 3.2 V to 6.35 V, it is used in battery charging and power domain isolation applications to reduce power dissipation and extend battery life. 2. Features and benefits 30 V tolerant VBUSI supply pin Wide supply voltage range from 3.2 V to 6.35 V Automatic switch operation for charging within the supply range I maximum 3 A continuous current SW Low ON resistance: 62 m (typical) at a supply voltage of 5.0 V 1.8 V control logic input to open the switch Soft start turn-on slew rate Protection circuitry Overtemperature protection Overvoltage lockout Undervoltage lockout ESD protection: HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV CDM AEC standard Q100-01 (JESD22-C101E) IEC61000-4-2 contact discharge exceeds 8 kV for pins VBUSI, D , D+ and ID Specified from 40 C to +85 CNX5P3001 NXP Semiconductors Bidirectional power switch for charger and USB-OTG combinations 3. Applications Smart and feature phones Tablets, eBooks 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version NX5P3001UK 40 C to +85 C WLCSP12 wafer level chip-scale package, 12 bumps NX5P3001 body 1.36 1.66 0.51 mm (Backside Coating included) 5. Marking Table 2. Marking codes Type number Marking code NX5P3001UK X05P3 6. Functional diagram (1 9%86,9% , & . DDD Fig 1. Logic symbol 9%86, 9%862 29/2 89/2 89/2 (1 &21752/ , &. 273 DDD Fig 2. Logic diagram (simplified schematic) NX5P3001 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved. Product data sheet Rev. 1 11 September 2013 2 of 20 862