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Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.TM FDL100N50F N-Channel UniFET FRFET MOSFET November 2013 FDL100N50F TM N-Channel UniFET FRFET MOSFET 500 V, 100 A, 55 m Features Description TM R = 43 m (Typ.) V = 10 V, I = 50 A UniFET MOSFET is Fairchild Semiconductors high voltage DS(on) GS D MOSFET family based on planar stripe and DMOS technology. Low Gate Charge (Typ. 238 nC) This MOSFET is tailored to reduce on-state resistance, and to Low C (Typ. 64 pF) rss provide better switching performance and higher avalanche 100% Avalanche Tested energy strength. The body diodes reverse recovery perfor- mance of UniFET FRFET MOSFET has been enhanced by Improved dv/dt Capability lifetime control. Its trr is less than 100nsec and the reverse dv/dt RoHS Compliant immunity is 15V/ns while normal planar MOSFETs have over 200nsec and 4.5V/nsec respectively. Therefore, it can remove Applications additional component and improve system reliability in certain Uninterruptible Power Supply applications in which the performance of MOSFETs body diode is significant. This device family is suitable for switching power AC-DC Power Supply converter applications such as power factor correction (PFC), flat panel display (FPD) TV power, ATX and electronic lamp bal- lasts. D G G D TO-264 S S o MOSFET Maximum Ratings T = 25 C unless otherwise noted. C Symbol Parameter FDL100N50F Unit V Drain to Source Voltage 500 V DSS V Gate to Source Voltage 30 V GSS o - Continuous (T = 25 C) 100 C I Drain Current A D o - Continuous (T = 100 C) 60 C I Drain Current - Pulsed (Note 1) 400 A DM E Single Pulsed Avalanche Energy (Note 2) 5000 mJ AS I Avalanche Current (Note 1) 100 A AR E Repetitive Avalanche Energy (Note 1) 73.5 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns o (T = 25 C) 2500 W C P Power Dissipation D o o - Derate Above 25C20W/ C o T , T Operating and Storage Temperature Range -55 to +150 C J STG o Maximum Lead Temperature for Soldering, 1/8 from Case for 5 Seconds T 300 C L Thermal Characteristics Symbol Parameter FDL100N50F Unit R Thermal Resistance, Junction to Case, Max. 0.05 JC o C/W R Thermal Resistance, Junction to Ambient, Max. 30 JA 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com 1 FDL100N50F Rev. C1