Product Information

KX112-1042

KX112-1042 electronic component of ROHM

Datasheet
Accelerometers Low Height Tri-Axis, User Selectable +/- 2g, 4g, 8g, Digital (I2C/SPI) Output, Integrated FIFO/FILO buffer, 2x2x0.6mm LGA

Manufacturer: ROHM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 8.8027 ea
Line Total: USD 8.8

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 28 May to Thu. 30 May

MOQ : 1
Multiples : 1
1 : USD 8.8027
10 : USD 2.7444
100 : USD 1.9262
500 : USD 1.6052
1000 : USD 1.5017
2500 : USD 1.4499
5000 : USD 1.4084
10000 : USD 1.367
20000 : USD 1.3463

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Sensing Axis
Acceleration
Sensitivity
Output Type
Resolution
Supply Voltage - Max
Supply Voltage - Min
Package / Case
Maximum Operating Temperature
Minimum Operating Temperature
Packaging
Brand
Interface Type
Mounting Style
Sensor Type
Moisture Sensitive
Operating Supply Current
Product Type
Factory Pack Quantity :
Subcategory
LoadingGif

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PART NUMBER: KX112-1042 2g / 4g / 8g Tri-axis Digital Rev. 5.0 Accelerometer Specifications 18-Jan-16 Product Description The KX112-1042 is a tri-axis 2g, 4g or 8g silicon micromachined accelerometer with integrated 2048 byte buffer, orientation, tap/double tap, activity detecting, and Free fall algorithms. The sense element is fabricated using Kionixs proprietary plasma micromachining process technology. Acceleration sensing is based on the principle of a differential capacitance arising from acceleration-induced motion of the sense element, which further utilizes common mode cancellation to decrease errors from process variation, temperature, and environmental stress. The sense element is hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is delivered in a 2 x 2 x 0.6 mm LGA plastic package operating from a 1.71 3.6V DC supply. Voltage regulators are used to maintain constant internal operating voltages over the range of input supply voltages. This results in 2 stable operating characteristics over the range of input supply voltages. I C or SPI digital protocol is used to communicate with the chip to configure and check for updates to the orientation, Directional TM Tap detection, Free fall detection and activity monitoring algorithms. Features 2 x 2 x 0.6 mm LGA User-selectable g Range up to 8g User-selectable Output Data Rate up to 25600Hz User-selectable low power or high resolution mode Digital High-Pass Filter Outputs Extra large embedded 2048 byte FIFO/FILO buffer Low Power Consumption with FlexSet Performance Optimization Internal voltage regulator TM Enhanced integrated Free fall, Directional Tap/Double-Tap , and Device-orientation Algorithms User-configurable wake-up function 2 Digital I C up to 3.4MHz Digital SPI up to 10MHz Lead-free Solderability Excellent Temperature Performance High Shock Survivability Factory Programmed Offset and Sensitivity Self-test Function 36 Thornwood Dr. Ithaca, NY 14850 2016 Kionix All Rights Reserved tel: 607-257-1080 fax:607-257-1146 www.kionix.com - info kionix.com Page 1 of 81 PART NUMBER: KX112-1042 2g / 4g / 8g Tri-axis Digital Rev. 5.0 Accelerometer Specifications 18-Jan-16 Table of Contents PRODUCT DESCRIPTION .................................................................................................................................................................... 1 FEATURES ......................................................................................................................................................................................... 1 TABLE OF CONTENTS ......................................................................................................................................................................... 2 FUNCTIONAL DIAGRAM .................................................................................................................................................................... 6 PRODUCT SPECIFICATIONS ................................................................................................................................................................ 7 MECHANICAL ............................................................................................................................................................................................ 7 ELECTRICAL ............................................................................................................................................................................................... 8 Start Up Time Profile ........................................................................................................................................................................ 9 Current Profile .................................................................................................................................................................................. 9 Power-On Procedure ....................................................................................................................................................................... 10 ENVIRONMENTAL ..................................................................................................................................................................................... 11 TERMINOLOGY ........................................................................................................................................................................................ 12 g ...................................................................................................................................................................................................... 12 Sensitivity ........................................................................................................................................................................................ 12 Zero-g offset ................................................................................................................................................................................... 12 Self-test ........................................................................................................................................................................................... 12 FUNCTIONALITY ....................................................................................................................................................................................... 13 Sense element ................................................................................................................................................................................. 13 ASIC interface ................................................................................................................................................................................. 13 Factory calibration .......................................................................................................................................................................... 13 APPLICATION SCHEMATIC AND PIN DESCRIPTION ........................................................................................................................................... 14 Application Schematic .................................................................................................................................................................... 14 Pin Descriptions .............................................................................................................................................................................. 14 TEST SPECIFICATIONS ................................................................................................................................................................................ 15 PACKAGE DIMENSIONS AND ORIENTATION ................................................................................................................................................... 16 Dimensions ..................................................................................................................................................................................... 16 Orientation ..................................................................................................................................................................................... 17 DIGITAL INTERFACE ......................................................................................................................................................................... 19 2 I C SERIAL INTERFACE ............................................................................................................................................................................... 19 2 I C Operation .................................................................................................................................................................................. 20 Writing to accelerometers 8-bit Register....................................................................................................................................... 22 Reading from accelerometers 8-bit Register ................................................................................................................................. 22 Data Transfer Sequences ................................................................................................................................................................ 23 HS-mode ......................................................................................................................................................................................... 24 2 I C Timing Diagram ......................................................................................................................................................................... 25 SPI COMMUNICATIONS............................................................................................................................................................................. 26 4-Wire SPI Interface ........................................................................................................................................................................ 26 4-Wire SPI Timing Diagram ............................................................................................................................................................ 27 36 Thornwood Dr. Ithaca, NY 14850 2016 Kionix All Rights Reserved tel: 607-257-1080 fax:607-257-1146 www.kionix.com - info kionix.com Page 2 of 81

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
LAPIS Semiconductor
RHE
RHM
ROHM Semicon
ROHM Semiconductor

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