Product Information

AXO215

AXO215 electronic component of TDK

Datasheet
Accelerometers MEMS Accelerometer 15G SPI JLCC28

Manufacturer: TDK
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

Stock Image

AXO215
TDK

1 : USD 443.026
5 : USD 427.7369
10 : USD 422.7433
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Sensing Axis
Acceleration
Sensitivity
Output Type
Resolution
Supply Voltage - Max
Supply Voltage - Min
Package / Case
Maximum Operating Temperature
Minimum Operating Temperature
Height
Length
Packaging
Series
Width
Brand
Interface Type
Mounting Style
Sensor Type
Operating Supply Current
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
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Tronics Microsystems S.A. 98 rue du Pr de lHorme, 38920 Crolles, France Phone: +33 (0)4 76 97 29 50 Fax: +33 (0)4 76 97 29 51 www.tronicsgroup.com AXO215 Datasheet MCD006-C Features In-plane linear accelerometer 15 g range Superior non-linearity of 100 ppm thanks to the closed-loop operation Excellent bias instability of 3 g 24 bit output with digital SPI interface Ultra low noise Embedded temperature sensor for on-chip or external temperature compensation Built-in Self-Test 12x12mm hermetic J-Lead ceramic package Weight : 1.4 grams Full compatibility with GYPRO products REACH and RoHS compliant Table of Contents Features ................................................................................. 1 General Description ............................................................... 1 Table of Contents ................................................................... 1 General Description Disclaimer............................................................................... 1 Block diagram ..................................................................... 2 AXO215 sensors consist in a MEMS transducer and an integrated circuit (IC) packaged in a 28-pins J-leaded Ceramic Overall Dimensions ............................................................ 2 Package. 1. Specifications .............................................................. 3 2. Maximum Ratings ....................................................... 5 AXO product is ideally complementing the industry-standard 3. Typical performances .................................................. 6 GYPRO product line. 4. Interface ...................................................................... 8 The MEMS transducer is manufactured using Tronics wafer- 4.1. Pinout, Sensitive Axis identification ........................ 8 level packaging technology based on micro-machined thick 4.2. Application circuit ................................................... 8 single crystal silicon. 4.3. Input/Output Pin Definitions .................................. 9 5. Soldering Recommendations .................................... 10 When the sensor is subjected to a linear acceleration, the 6. Digital SPI interface ................................................... 11 acceleration acts on the proof-mass, which is itself 6.1. Electrical and Timing Characteristics .................... 11 counterbalanced by electrostatic forces (closed-loop 6.2. SPI frames description .......................................... 12 operation). 6.3. Acceleration readings ........................................... 12 The sensor is factory calibrated and compensated for 6.4. Temperature readings .......................................... 12 temperature effects to provide high-accuracy digital output 6.5. Advanced use of SPI registers ............................... 13 over a broad temperature range. 7. Temperature Sensor Calibration Procedure ............. 15 7.1. Temperature sensor calibration model ................ 15 Raw data output can be also chosen to enable customer-made 7.2. Recommended Procedure .................................... 15 compensations. 8. Device Identification ................................................. 15 9. Internal construction and Theory of Operation ........ 16 10. Available Tools and Resources .................................. 17 Disclaimer Information furnished by Tronics is believed to be accurate and reliable. However, no responsibility is assumed by Tronics for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specification subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Tronics. Trademarks and registered trademarks are the property of their respective owners. Internal ref. : MCD006-C Copyright 2017 Tronics Microsystems S.A.. All rights reserved. Page 1 Specification subject to change without notice. Tronics Microsystems S.A. 98 rue du Pr de lHorme, 38920 Crolles, France Phone: +33 (0)4 76 97 29 50 Fax: +33 (0)4 76 97 29 51 www.tronicsgroup.com AXO215 Datasheet MCD006-C Block diagram Overall Dimensions Internal ref. : MCD006-C Copyright 2017 Tronics Microsystems S.A.. All rights reserved. Page 2 Specification subject to change without notice.

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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