BYV10ED-600PJ

BYV10ED-600P Ultrafast power diode 4 July 2017 Product data sheet 1. General description Enhanced ultrafast power diode in a TO252 (DPAK) plastic package. 2. Features and benefits High thermal cycling performance Soft recovery characteristic Low on-state losses Surface-mountable package Low thermal resistance Enhanced avalanche energy capability 3. Applications Dual Mode (DCM and CCM) PFC Power Factor Correction (PFC) for Interleaved Topology 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Values Unit Absolute maximum rating V repetitive peak reverse 600 V RRM voltage I average forward current = 0.5 square-wave pulse T 118 C 10 A F(AV) mb Fig. 1 Fig. 2 Fig. 3 I repetitive peak forward = 0.5 t = 25 s T 118 C 20 A FRM p mb current square-wave pulse I non-repetitive peak t = 10 ms T = 25 C sine-wave pulse 70 A FSM p j(init) forward current Fig. 4 t = 8.3 ms T = 25 C sine-wave pulse 80 A p j(init) Symbol Parameter Conditions Min Typ Max Unit Static characteristics V forward voltage I = 10 A T = 25 C Fig. 6 - 1.5 2 V F F j I = 10 A T = 150 C Fig. 6 - - 1.6 V F j Dynamic characteristics t reverse recovery time I = 1 A V = 30 V dI /dt = 50 A/s - 35 50 ns rr F R F T = 25 C Fig. 7 j I = 10 A V = 200 V dI /dt = 200 A/s - 50 - ns F R F T = 25 C Fig. 7 j I = 10 A V = 200 V dI /dt = 200 A/s - 78 - ns F R F T = 125 C Fig. 7 jWeEn Semiconductors BYV10ED-600P Ultrafast power diode 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol mb 1 n.c. not connected K A 001aaa020 2 K cathode 1 3 A anode mb mb mounting base connected to cathode DPAK (TO252N) 1 It is not possible to connect to pin 2 of the SOT428 package. 6. Ordering information Table 3. Ordering information Type number Package Name Description Version BYV10ED-600P DPAK plastic single-ended surface-mounted package (DPAK) 3 leads TO252N (one lead cropped) 7. Marking Table 4. Marking codes Type number Marking code BYV10ED-600P BYV10ED-600P BYV10ED-600P All information provided in this document is subject to legal disclaimers. WeEn Semiconductors Co., Ltd. 2016. All rights reserved Product data sheet 4 July 2017 2 / 10