X-On Electronics has gained recognition as a prominent supplier of W25Q02JVTBIM nor flash across the USA, India, Europe, Australia, and various other global locations. W25Q02JVTBIM nor flash are a product manufactured by Winbond. We provide cost-effective solutions for nor flash, ensuring timely deliveries around the world.

W25Q02JVTBIM Winbond

W25Q02JVTBIM electronic component of Winbond
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Part No.W25Q02JVTBIM
Manufacturer: Winbond
Category:NOR Flash
Description: NOR Flash spiFlash, 2G-bit, 4Kb Uniform Sector
Datasheet: W25Q02JVTBIM Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 25.4387 ea
Line Total: USD 25.44

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 13 Jun to Mon. 17 Jun

MOQ : 1
Multiples : 1
1 : USD 24.656
10 : USD 23.345
25 : USD 22.7815
50 : USD 20.332
100 : USD 19.7685
250 : USD 19.7685
480 : USD 19.7685
2880 : USD 19.7685

     
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We are delighted to provide the W25Q02JVTBIM from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q02JVTBIM and other electronic components in the NOR Flash category and beyond.

W25Q02JV-DTR 3.0V 2G-BIT (QUAD DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: April 19, 2021 - 1 - -Revision B W25Q02JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 7 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 8 3.1 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array) ............................................................ 8 3.2 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 SPI / QPI DTR Read Instructions ......................................................................................... 12 6.1.6 3-Byte / 4-Byte Address Modes ............................................................................................ 12 6.1.7 Hold Function ....................................................................................................................... 13 6.1.8 Software Reset & Hardware /RESET pin .............................................................................. 13 6.2 Write Protection .................................................................................................................. 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 16 7.1 Status Registers ................................................................................................................. 16 7.1.1 Program/Erase/Write In Progress (BUSY) Status Only ..................................................... 16 7.1.2 Write Enable Latch (WEL) Status Only ............................................................................. 16 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable .......................... 17 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable .......................................... 17 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................... 17 7.1.6 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable .................................. 17 7.1.7 Erase/Program Suspend Status (SUS) Status Only .......................................................... 18 7.1.8 Security Register Lock Bits (LB3, LB2, LB1) Non-Volatile OTP Writable .......................... 18 7.1.9 Quad Enable (QE) Volatile/Non-Volatile Writable ............................................................. 18 7.1.10 Current Address Mode (ADS) Status Only ...................................................................... 19 7.1.11 Power-Up Address Mode (ADP) Non-Volatile Writable ................................................... 19 7.1.12 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ........................................ 19 7.1.13 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ............................. 19 7.1.14 /HOLD or /RESET Pin Function (HOLD/RST) Volatile/Non-Volatile Writable .................. 20 Publication Release Date: April 19, 2021 - 2 - -Revision B

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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