Product Information

W9425G6KH-5

Hot W9425G6KH-5 electronic component of Winbond

Datasheet
4 M X 4 BANKS X16 BITS DDR SDRAM

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.758 ea
Line Total: USD 1.76

3332 - Global Stock
Ships to you between
Mon. 13 May to Thu. 16 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
3330 - Global Stock


Ships to you between
Mon. 13 May to Thu. 16 May

MOQ : 1
Multiples : 1

Stock Image

W9425G6KH-5
Winbond

1 : USD 1.758
10 : USD 1.4719
30 : USD 1.3141
108 : USD 1.1346
540 : USD 1.0556
864 : USD 1.02

195 - Global Stock


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 1
Multiples : 1

Stock Image

W9425G6KH-5
Winbond

1 : USD 2.5645
10 : USD 2.3
108 : USD 2.07
540 : USD 1.9665
1080 : USD 1.8975
2592 : USD 1.8745
5076 : USD 1.8055
10044 : USD 1.771
25056 : USD 1.748

     
Manufacturer
Product Category
Type
Mounting Style
Package / Case
Data Bus Width
Organisation
Memory Size
Maximum Clock Frequency
Access Time
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Hts Code
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W949D2DBJX5I electronic component of Winbond W949D2DBJX5I

DRAM 512Mb LPDDR, x32, 200MHz, Industrial Temp, 46nm
Stock : 0

W949D2DBJX5E electronic component of Winbond W949D2DBJX5E

DRAM Chip Mobile LPDDR SDRAM 512Mbit 16Mx32 1.8V 90-Pin VFBGA
Stock : 105

W947D6HBHX5I electronic component of Winbond W947D6HBHX5I

DRAM Chip Mobile LPDDR SDRAM 128Mbit 8Mx16 1.8V 60-Pin VFBGA
Stock : 0

W9464G6KH-5 electronic component of Winbond W9464G6KH-5

DRAM Chip DDR SDRAM 64Mbit 4Mx16 2.5V 66-Pin TSOP-II
Stock : 0

W9425G6KH-5 TR electronic component of Winbond W9425G6KH-5 TR

DRAM 256Mb DDR SDRAM x16, 200Mhz, 65nm T&R
Stock : 0

W948D2FBJX5I electronic component of Winbond W948D2FBJX5I

DRAM Chip DDR SDRAM 256Mbit 8Mx32 1.8V 90-Pin VFBGA
Stock : 0

W948D6FBHX5E electronic component of Winbond W948D6FBHX5E

DRAM Chip Mobile LPDDR SDRAM 256Mbit 16Mx16 1.8V 60-Pin VFBGA
Stock : 0

W948D6FBHX5I electronic component of Winbond W948D6FBHX5I

DRAM Chip Mobile LPDDR SDRAM 256Mbit 16Mx16 1.8V 60-Pin VFBGA
Stock : 0

W948D6KBHX5I electronic component of Winbond W948D6KBHX5I

DRAM 256Mb LPDDR, x16, 200MHz, Industrial Temp
Stock : 42

W9425G6KH-5I electronic component of Winbond W9425G6KH-5I

DRAM 256M DDR SDRAM x16 200Mhz Ind temp
Stock : 312

Image Description
W9425G6JB-5I electronic component of Winbond W9425G6JB-5I

DRAM Chip DDR SDRAM 256Mbit 16Mx16 2.5V 60-Pin TFBGA
Stock : 0

W9412G6KH-5 TR electronic component of Winbond W9412G6KH-5 TR

DRAM 128Mb DDR SDRAM x16 200MHz, 46nm T&R
Stock : 0

W9412G6KH-5I electronic component of Winbond W9412G6KH-5I

DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 284

W631GG6KB-12 electronic component of Winbond W631GG6KB-12

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA
Stock : 0

W3H64M72E-533SBI electronic component of Microchip W3H64M72E-533SBI

DRAM Memory
Stock : 0

W3E32M72SR-266SBM electronic component of Microchip W3E32M72SR-266SBM

DRAM Memory
Stock : 0

W3E32M72S-266SBI electronic component of Microchip W3E32M72S-266SBI

DRAM Memory
Stock : 0

W332M72V-125BI electronic component of Microchip W332M72V-125BI

DRAM Memory
Stock : 0

AS4C128M16D2-25BCN electronic component of Alliance Memory AS4C128M16D2-25BCN

DRAM 2G 1.8V 400Mhz 128M x 16 DDR2
Stock : 272

AS4C16M16S-7TCNTR electronic component of Alliance Memory AS4C16M16S-7TCNTR

DRAM 256Mb, 3.3V, 143Mhz 16M x 16 SDRAM
Stock : 0

W9425G6KH 4 M 4 BANKS 16 BITS DDR SDRAM Table of Contents- 1. GENERAL DESCRIPTION ............................................................................................................................. 4 2. FEATURES .................................................................................................................................................... 4 3. ORDER INFORMATION ................................................................................................................................ 4 4. KEY PARAMETERS ...................................................................................................................................... 5 5. PIN CONFIGURATION .................................................................................................................................. 6 6. PIN DESCRIPTION ........................................................................................................................................ 7 7. BLOCK DIAGRAM ......................................................................................................................................... 8 8. FUNCTIONAL DESCRIPTION ....................................................................................................................... 9 8.1 Power Up Sequence .......................................................................................................................... 9 8.2 Command Function .......................................................................................................................... 10 8.2.1 Bank Activate Command ...................................................................................................... 10 8.2.2 Bank Precharge Command .................................................................................................. 10 8.2.3 Precharge All Command ...................................................................................................... 10 8.2.4 Write Command ................................................................................................................... 10 8.2.5 Write with Auto-precharge Command................................................................................... 10 8.2.6 Read Command ................................................................................................................... 10 8.2.7 Read with Auto-precharge Command .................................................................................. 10 8.2.8 Mode Register Set Command .............................................................................................. 11 8.2.9 Extended Mode Register Set Command .............................................................................. 11 8.2.10 No-Operation Command ...................................................................................................... 11 8.2.11 Burst Read Stop Command .................................................................................................. 11 8.2.12 Device Deselect Command .................................................................................................. 11 8.2.13 Auto Refresh Command ....................................................................................................... 11 8.2.14 Self Refresh Entry Command ............................................................................................... 12 8.2.15 Self Refresh Exit Command ................................................................................................. 12 8.2.16 Data Write Enable /Disable Command ................................................................................. 12 8.3 Read Operation ................................................................................................................................ 12 8.4 Write Operation ................................................................................................................................ 13 8.5 Precharge ......................................................................................................................................... 13 8.6 Burst Termination ............................................................................................................................. 13 8.7 Refresh Operation ............................................................................................................................ 13 8.8 Power Down Mode ........................................................................................................................... 14 8.9 Input Clock Frequency Change during Precharge Power Down Mode ............................................ 14 8.10 Mode Register Operation ................................................................................................................. 14 8.10.1 Burst Length field (A2 to A0) ................................................................................................ 14 8.10.2 Addressing Mode Select (A3) ............................................................................................... 15 8.10.3 CAS Latency field (A6 to A4) ................................................................................................ 16 8.10.4 DLL Reset bit (A8) ................................................................................................................ 16 8.10.5 Mode Register /Extended Mode register change bits (BA0, BA1) ........................................ 16 8.10.6 Extended Mode Register field .............................................................................................. 16 8.10.7 Reserved field ...................................................................................................................... 16 9. OPERATION MODE .................................................................................................................................... 17 Publication Release Date: Nov. 17, 2014 Revision: A02 - 1 - W9425G6KH 9.1 Simplified Truth Table ...................................................................................................................... 17 9.2 Function Truth Table ........................................................................................................................ 18 9.3 Function Truth Table for CKE ........................................................................................................... 21 9.4 Simplified Stated Diagram ................................................................................................................ 22 10. ELECTRICAL CHARACTERISTICS ............................................................................................................ 23 10.1 Absolute Maximum Ratings .............................................................................................................. 23 10.2 Recommended DC Operating Conditions ........................................................................................ 23 10.3 Capacitance ..................................................................................................................................... 24 10.4 Leakage and Output Buffer Characteristics ...................................................................................... 24 10.5 DC Characteristics ........................................................................................................................... 25 10.6 AC Characteristics and Operating Condition .................................................................................... 26 10.7 AC Test Conditions .......................................................................................................................... 27 11. SYSTEM CHARACTERISTICS FOR DDR SDRAM..................................................................................... 29 11.1 Table 1: Input Slew Rate for DQ, DQS, and DM .............................................................................. 29 11.2 Table 2: Input Setup & Hold Time Derating for Slew Rate ............................................................... 29 11.3 Table 3: Input/Output Setup & Hold Time Derating for Slew Rate .................................................... 29 11.4 Table 4: Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate .................................... 29 11.5 Table 5: Output Slew Rate Characteristics (x16 Devices only) ........................................................ 29 11.6 Table 6: Output Slew Rate Matching Ratio Characteristics .............................................................. 30 11.7 Table 7: AC Overshoot/Undershoot Specification for Address and Control Pins.............................. 30 11.8 Table 8: Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins............................... 31 11.9 System Notes: .................................................................................................................................. 32 12. TIMING WAVEFORMS ................................................................................................................................ 34 12.1 Command Input Timing .................................................................................................................... 34 12.2 Timing of the CLK Signals ................................................................................................................ 34 12.3 Read Timing (Burst Length = 4) ....................................................................................................... 35 12.4 Write Timing (Burst Length = 4) ....................................................................................................... 36 12.5 DM, DATA MASK (W9425G6KH) ..................................................................................................... 37 12.6 Mode Register Set (MRS) Timing ..................................................................................................... 38 12.7 Extend Mode Register Set (EMRS) Timing ...................................................................................... 39 12.8 Auto-precharge Timing (Read Cycle, CL = 2) .................................................................................. 40 12.9 Auto-precharge Timing (Read cycle, CL = 2), continued .................................................................. 41 12.10 Auto-precharge Timing (Write Cycle) ............................................................................................... 42 12.11 Read Interrupted by Read (CL = 2, BL = 2, 4, 8) .............................................................................. 43 12.12 Burst Read Stop (BL = 8) ................................................................................................................. 43 12.13 Read Interrupted by Write & BST (BL = 8) ....................................................................................... 44 12.14 Read Interrupted by Precharge (BL = 8) .......................................................................................... 44 12.15 Write Interrupted by Write (BL = 2, 4, 8) ........................................................................................... 45 12.16 Write Interrupted by Read (CL = 2, BL = 8) ...................................................................................... 45 12.17 Write Interrupted by Read (CL = 3, BL = 4) ...................................................................................... 46 12.18 Write Interrupted by Precharge (BL = 8) ........................................................................................... 46 12.19 2 Bank Interleave Read Operation (CL = 2, BL = 2) ......................................................................... 47 12.20 2 Bank Interleave Read Operation (CL = 2, BL = 4) ......................................................................... 47 12.21 4 Bank Interleave Read Operation (CL = 2, BL = 2) ......................................................................... 48 12.22 4 Bank Interleave Read Operation (CL = 2, BL = 4) ......................................................................... 48 12.23 Auto Refresh Cycle .......................................................................................................................... 49 12.24 Precharged/Active Power Down Mode Entry and Exit Timing .......................................................... 49 12.25 Input Clock Frequency Change during Precharge Power Down Mode Timing ................................. 49 12.26 Self Refresh Entry and Exit Timing ................................................................................................... 50 Publication Release Date: Nov. 17, 2014 Revision: A02 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted