X-On Electronics has gained recognition as a prominent supplier of W25X05CLSNIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25X05CLSNIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25X05CLSNIG Winbond

W25X05CLSNIG electronic component of Winbond
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See Product Specifications
Part No.W25X05CLSNIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash Serial-SPI 2.5V/3.3V 512K-bit 64K/32K x 8/16-bit 8ns 8-Pin SOIC
Datasheet: W25X05CLSNIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.355 ea
Line Total: USD 0.36 
Availability - 460
Ship by Wed. 13 Nov to Fri. 15 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
460
Ship by Wed. 13 Nov to Fri. 15 Nov
MOQ : 1
Multiples : 1
1 : USD 0.355
10 : USD 0.3502
2000 : USD 0.2934
10000 : USD 0.2801

   
Manufacturer
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We are delighted to provide the W25X05CLSNIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25X05CLSNIG and other electronic components in the NOR Flash category and beyond.

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W25X05CL 2.5 / 3 / 3.3 V 512K-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI Publication Release Date: August 6, 2012 - 1 - Revision A W25X05CL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. PIN CONFIGURATION SOIC 150-MIL, VSOP 150-MIL, TSSOP 173-MIL ................................ 5 4. PAD CONFIGURATION WSON 6X5-MM AND USON 2X3-MM ................................................ 5 5. PIN DESCRIPTION SOIC VSOP 150-MIL, WSON 6X5-MM AND USON 2X3-MM ................... 5 5.1 Package Types ............................................................................................................... 6 5.2 Chip Select (/CS) ............................................................................................................ 6 5.3 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 6 5.4 Write Protect (/WP) ......................................................................................................... 6 5.5 HOLD (/HOLD)................................................................................................................ 6 5.6 Serial Clock (CLK) .......................................................................................................... 6 6. BLOCK DIAGRAM ...................................................................................................................... 7 7. FUNCTIONAL DESCRIPTION.................................................................................................... 8 7.1 SPI OPERATIONS ......................................................................................................... 8 7.1.1 Standard SPI Instructions ................................................................................................. 8 7.1.2 Dual SPI Instructions ........................................................................................................ 8 7.1.3 Hold Function ................................................................................................................... 8 7.2 WRITE PROTECTION .................................................................................................... 9 7.2.1 Write Protect Features ...................................................................................................... 9 8. CONTROL AND STATUS REGISTERS ................................................................................... 10 8.1 STATUS REGISTER .................................................................................................... 10 8.1.1 BUSY .............................................................................................................................. 10 8.1.2 Write Enable Latch (WEL) .............................................................................................. 10 8.1.3 Block Protect Bits (BP1, BP0) ........................................................................................ 10 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 10 8.1.5 Reserved Bits ................................................................................................................. 11 8.1.6 Status Register Protect (SRP) ........................................................................................ 11 8.1.7 Status Register Memory Protection ................................................................................ 12 8.2 INSTRUCTIONS ........................................................................................................... 13 8.2.1 Manufacturer and Device Identification .......................................................................... 13 8.2.2 Instruction Set ............................................................................................................... 14 8.2.3 Write Enable (06h).......................................................................................................... 15 8.2.4 Write Enable for Volatile Status Register (50h) .............................................................. 15 8.2.5 Write Disable (04h) ......................................................................................................... 16 8.2.6 Read Status Register (05h) ............................................................................................ 16 8.2.7 Write Status Register (01h) ............................................................................................ 17 8.2.8 Read Data (03h) ............................................................................................................. 18 8.2.9 Fast Read (0Bh) ............................................................................................................. 19 8.2.10 Fast Read Dual Output (3Bh) ....................................................................................... 20 8.2.11 Fast Read Dual I/O (BBh) ............................................................................................. 21 8.2.12 Continuous Read Mode Bits (M7-0) ............................................................................. 23 8.2.13 Continuous Read Mode Reset (FFFFh) ....................................................................... 23 8.2.14 Page Program (02h) ..................................................................................................... 24 8.2.15 Sector Erase (20h) ....................................................................................................... 25 Publication Release Date: August 6, 2012 - 2 - Revision A

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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