Product Information

UPC-CHT01-A10-0232

UPC-CHT01-A10-0232 electronic component of Aaeon

Datasheet
Single Board Computers UP board with z8350 CPU, 2GB RAM+32GB eMMC, passive heatsink, WIFI 802.11 b/g/n + Bluetooth 4.2 on board powered by AMPAK AP6214A

Manufacturer: Aaeon
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 142.0714
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1
1 : USD 224.91
3 : USD 211.95
N/A

Obsolete
     
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RoHS - XON
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starting at 89 1GB RAM /16 GB eMMC core specification BIOS reflash pin Intel Atom Fan power 100-pin docking eMMC RTC Battery x5-Z8350 connector Reset button for toggle switch Reset button 2x USB2.0 1x MIPI-CSI 1x UART0 (4 lane) 1x DSI/eDP DDR3-L 1x MIPI-CSI (2 lane) WiFi / BT Antenna Power button 5V DC-in Power jack HDMI USB3.0 WiFi+ Bluetooth UP Core is a miniature board with the high performance and low power consumption When it comes to security, UP Core has Intel security features needed for professional features of the latest tablet technology: the Intel Atom x5 Z8350 Processors IoT applications such Intel AES New Instructions and Intel IdentityProtection Technology. (codename Cherry Trail) 64 bits up to 1.92GHz. The internal GPU is the new Intel Gen 8 HD 400 with 12 Execution Units up to 500MHz to deliver extremely high 3D graphic Its UP to you to choose which operation system is best for your application. The CPU is performance. supported by Android 6.Marshmallow, Microsoft Windows 10 and we support and enable Linux, through our UP Community. UP Core is equipped with 1GB/2GB/4GB DDR3L RAM and 16GB/32GB/64GB eMMC. With 100-pin docking connector, UP Core provides the freedom to makers to build up UP Core has a standard industrial PC operating temperature range of 32-140 F / their carrier board. There are more interfaces available, such as 2x port USB2.0 + 1x 0-60C, which makes it flexible for many applications. UART on header, 1x USB 3.0 host, WiFi, Bluetooth 1x DSI/eDP port, 2x Camera (MIPI-CSI), 1x HMDI, RTC. core - Specifications SOC USB Intel Atom x5-Z8350 (2M Cache, up to 1.84 GHz) 1x USB 3.0 Host 2x USB 2.0 pin header Graphics Intel HD 400 Graphics WiFi / BT WiFi 802.11 b/g/n 2.4 GHz Memory Bluetooth 4.0 (BLE) 2GB / 4GB onboard DDR3L-1600 Expansion Storage Capacity Docking Connector 100 pin 16GB / 32GB / 64 GB eMMC Compatible Operating system Video & Audio Microsoft Windows 10 (full), Windows IOT Core, Linux 1x HDMI (ubilinux, Ubuntu, Yocto), Android Marshmallow 1x Full eDP Audio via HDMI and I2S (from Docking) Dimensions 56.50 mm 66 mm Camera interface 1x MIPI-CSI 2 lane Certificate 1x MIPI-CSI 4 lane CE/FCC Class A, RoHS complaint, REACH Power 5V DC-in 4A 5.5/2.1mm jack Operating humidity 10%80%RH non-condensing Operating Tempature 32-140F / 0~60C www.up-board.org /www.up-shop.org / www.up-community.orgDDI2 1x64b HDMI Type B 1600 MHz DDR3L-RS HDMI 1.4P - 1920 x 1080 Max 4GB CSI 1 2 Channel FPC Connector eMMC eMMC 1x 21 pin 32 GB / 16 GB CSI 0 4 Channel FPC Connector SDI0 1x 31 pin Optional carrier board AP6214A WiFi & BT UART2 DSI 0 FPC/FFC Connector 1x 40 pin DDI0 USB2 2, USB2 3 10 pin connector Cherry Trail-T3 UART0 17 x 17 mm USB HSIC x 2 USB3 0, USB2 1 USB3.0 Type A Intel Atom USB2.0 Port 0, 1 D X5-8350 SD-Card 5V 3A F/W Update Carrier connector Power from IO Board l2C, SPI, PWM IO board l2S, UART1, GPIO Dock Conn Dock Conn Fast SPI Flash Rom Header Socket PCI-E Gen2 x1 P5KS 5.0mm header P5KS 5.0mm Socket PMC Sgnals Fan Out AXK6S00547YG AXK6S00547YG Fan Connector 1x 100 pin 1x 100 pin Signals HDMI SMBUS Powerbutton HPD Switch Button Reset button Power button Power Rail Reset Button PMIC l2C VSYS DC-IN DC Jack SYS VR 5V 4A core - Block Diagram core - Pin out 1 21 41 61 81 5V Ground RESERVE PCIE RX0 DP I2C1 SOC SCL 2 22 42 62 82 5V DDI2 DDC CLK CPLD DIN/ISH GPIO7 Ground SD3 WP 3 5V 23 GPIO7/HAT SPI2 MOSI 43 Ground 63 PCIE RX0 DN 83 Ground 4 24 44 64 84 5V DDI2 DDC DAT ISH GPIO9 USB2 P0 DP SD3 CLK 5 25 45 65 85 5V GPIO8/SPI MISO GPIO18/I2S2 CLK Ground CPLD DOUT/ISH I2C1 DATA 6 5V 26 HDMI D 46 GPIO25/PWM0 66 USB2 P0 DN 86 SD3 SD0 7 27 47 67 87 5V GPIO9/SPI CLK GPIO14/I2S2 FRM PCIE REFCLK0 DP ISH I2C1 CLK 8 28 48 68 88 5V HDMI R GPIO13/PWM1 Ground SD3 SD1 9 29 49 69 89 Ground GPIO22/SPI CS0N GPIO27/I2S2 DATAIN PCIE REFCLK0 DN Ground 10 30 50 70 90 Ground DDI2 TYPE C HPD Ground USB OTG R ID SD3 SD2 11 PMU RSTBTN N 31 GPIO23/SPI CS1N 51 GPIO28/I2S2 DATAOUT 71 Ground 91 RESERVE 12 32 52 72 92 UART1 RTS ISH GPIO0 USB HSIC 1 DATA Ground SD3 SD3 13 33 53 73 93 PMU PWRBTN N Ground Ground I2C0 SOC SDA RESERVE 14 34 54 74 94 UART1 CTS CPLD CLEAR/ISH GPIO1 USB HSIC 1 STROBE SD3 CD Ground 15 35 55 75 95 PMU SLP S0IX N RESERVE PCIE TX0 DP I2C0 SOC SCL RESERVE 16 36 56 76 96 GPIO16/UART1 TX ISH GPIO2 Ground SD3 CMD CPLD OE/GPIO SW78 17 37 57 77 97 PCIE CLKREQ0 RESERVE PCIE TX0 DN Ground RESERVE 18 38 58 78 98 GPIO17/UART1 RX ISH GPIO3 USB HSIC 2 DATA SD3 1P8 EN CPLD RST/GPIO SUS8 19 39 59 79 99 PMC SUSCLK0 RESERVE Ground I2C1 SOC SDA RESERVE 20 40 60 80 100 Ground ISH GPIO4 USB HSIC 2 STROBE SD3 PWREN CPLD STROBE/GPIO SUS9 Part number : Coming soon TheAndroi name and the Android logo are property of Google Inc. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Intel, the Intel logo, Intel Insider, Intel SpeedStep, and Atom are trademarks of Intel www.up-board.org/ www.up-shop.org /www.up-community.org Corporation in the U.S. and/or other countries. All rights reserved. UP Bridge The Gap is Trademark of Aaeon Europe. All Rights reserved.

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:
AAEON ELECTRONIC
AAEON ELECTRONICS
AAEON UP

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