, Thermal Division of Boyd CorporationThe 533802B02500G with Heat Sinks Board Level, Extruded Heat Sink, TO220, Vertical, PC Pin, 25.4x34.93x12.70mm manufactured by Aavid, Thermal Division of Boyd Corporation is a thermally conductive board level extruded heat sink used for various TO-220 and the TO-3-style electrical components. It is a single piece aluminum extrusion and thermally conductive fin that can easily be added to any electronic board for improved thermal conductivity. It features a black anodized finish, a vertical mount PC pin configuration, and non-magnetic properties. The overall dimensions of the heat sink are 25.4x34.93x12.70mm.