Express-BL COM Express Basic Size Type 6 Module with 5th Generation Intel Core processor and Intel Xeon E3-12xx processor Features 5th Generation Intel Core i7 and Xeon E3-12xx processor with Intel QM87 Chipset Up to 32GB Dual Channel DDR3L at 1600MHz Three DDI channels, LVDS/eDP and VGA, supports up to 3 independent displays Up to Eight PCIe x1 (build option), one PCIe x16 GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0 Supports Smart Embedded Management Agent (SEMA ) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System Video CPU GPU Feature Support 5th Generation Intel Core and Xeon Processors (Mobile) - 14nm Generation 8 Intel Graphics architecture, supporting 3 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS, VGA or eDP Xeon E3-1278L v4 2.0/3.3GHz (Turbo), 0.8/1.0GHz (Turbo), 47W (4C/GT3e) (build option) Xeon E3-1258L v4 1.8/3.2GHz (Turbo), 0.7/1.0GHz (Turbo), 47W (4C/GT2) Encode/transcode HD content Core i7-5850EQ 2.7/3.4GHz (Turbo), 0.3/1.0GHz (Turbo), 47W (4C/GT3e) Playback of high definition content including Blu-ray Disc Core i7-5700EQ 2.6/3.4GHz (Turbo), 0.3/1.0GHz (Turbo), 47W (4C/GT2) Advanced Scheduler 2.0, 1.0 XPDM support Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 DirectX 11.1, DirectX 11.1+, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel support AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX. OpenGL 4.0, OpenGL 4.2 support Note: Availability of features may vary between processor SKUs. Digital Display Interface Memory Digital Display Interface Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 32GB in dual DDI1/2/3 supporting DisplayPort/HDMI/DVI SODIMM socket VGA Embedded BIOS Analog VGA support with 300 MHz DAC AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 10 support Analog monitor support up to QXGA (2048 x 1536) Cache LVDS 6MB for Xeon E3-1278L v4, E3-1258L v4 and Core i7-5850EQ, i7-5700EQ Single/dual channel 18/24-bit LVDS from eDP (two lanes) Expansion Busses eDP 1 PCIe x16 (Gen3), or 2 PCIe x8, or 1 PCIe x8 and 2 PCIe x4 By build option, in place of LVDS and VGA 6 PCIe x1 (AB): Lanes 0/1/2/3/4/5 2 PCIe x1 (CD): Lanes 6/7 (Lane 7 by build option) Audio LPC bus, SMBus (system) , I2C (user) Chipset SEMA Board Controller Intel HD Audio integrated in chipset Voltage/current monitoring, power sequence debug support, AT/ATX mode Audio Codec control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan control Located on carrier Express-BASE6 (ALC886 standard support) Debug Headers Ethernet 40-pin multipurpose flat cable connector for use in combination with DB-40 Intel MAC/PHY: I218LM with Intel AMT 10.0 support debug module providing BIOS Interface: 10/100/1000 GbE connection POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. NewSpecifications I/O Interfaces Mechanical and Environmental USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7) Form Factor: PICMG COM.0: Rev 2.1 Type 6 SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) Dimension: Basic size: 125 mm x 95 mm Serial: 2 UART ports COM1/2 with console redirection Operating Temperature GPIO: 4 GPO and 4 GPI Standard: 0C to 60C Extreme Rugged: -40C to +85C (build option) Super I/O Supported on carrier if needed (standard support for W83627DHG-P) Humidity 5-90% RH operating, non-condensing TPM 5-95% RH storage (and operating with conformal coating) Chipset: Atmel AT97SC3204 Shock and Vibration Type: TPM 1.2 IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Power Table 214-I, Condition D Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% Wide Input: ATX = 8.5~20 V / 5Vsb 5% or AT = 8.5 ~20V HALT (standard temp. only) Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, Operating Systems WOL S3/S4/S5) Standard Support ECO Mode: Support deep S5 mode for power saving Windows 7 32/64-bit, Windows 8.1 64-bit, Linux 64-bit Extended Support (BSP) WES7 32/64-bit, Windows Embedded 8 Std., Linux 64-bit, VxWorks 64-bit Note: Build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with build options will need to be created and may cause production lead times.