nanoX-BT Extreme Rugged COM Express Mini Size Type 10 Module with Intel Atom E3800 series or Celeron Processor SoC Features Single, dual, quad-core Intel Atom or Celeron Processor SoC Up to 4GB soldered Dual Channel DDR3L at 1333MHz One DDI channel, one LVDS (build option, eDP) Three PCIe x1 GbE, two SATA 3Gb/s, four USB and one USB client Supports Smart Embedded Management Agent (SEMA ) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System CPU Debug Headers Single, dual, quad-core Intel Atom or quad-core Celeron 40-pin multipurpose flat cable connector Use in combination with DB-40 debug module Atom E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333) providing BIOS POST code LED, BMC access, SPI BIOS flashing, power test points, Atom E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333) debug LEDs Atom E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066) Atom E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066) 60-pin XDP header for ICE debug of CPU/chipset on break out board Atom E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066)Atom E3805 1.33 GHz (No GFX) 3W (2C/1066) GPU Feature Support Celeron N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333) 7th generation Intel graphics core architecture with four execution units Celeron J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333) supporting two independent displays Supports: Single, dual or quad Out-of-Order Execution (OOE) processor cores, 3D graphics hardware acceleration Intel VT-x, Intel SSE4.1 and SSE4.2, Intel 64 architecture, IA 32-bit , Supports for DirectX11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2 PCLMULQDQ Instruction DRNG, Intel Thermal Monitor (TM1 & TM2) Note: Availability of features may vary between processor SKUs. Video decode hardware acceleration including support for H.264, MPEG2, MVC, VC-1, WMV9 and VP8 formats Memory Video encode hardware acceleration including support for H.264, MPEG2 and Single channel non-ECC 1333/1066 MHz soldered DDR3L memory up to 4GB MVC formats (2GB or 4GB) Digital Display Interface Embedded BIOS One DDI channel supporting DisplayPort/HDMI/DVI AMI EFI with CMOS backup in 8MB SPI BIOS LVDS/eDP Cache Single channel 18/24-bit LVDS Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data (BOM option support for 24-bit EDID panel) cache eDP support (build option) 2MB for E3845, N2930 and J1900 1MB for E3827, E3826, E3825 and E3805 Audio 512K for E3815 Chipset Expansion Busses Intel HD Audio integrated in SOC 3 PCI Express x1 Gen2 (AB): Ianes 0/1/2 Audio Codec optional PCIe x4 (lose GbE) Located on carrier miniBASE-10R LPC bus, SMBus (system), I2C (user) SEMA Board Controller Ethernet Supports: Voltage/Current monitoring, Power sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Intel MAC/PHY: Intel i210LM (MAC/PHY) Ethernet controller Purpose I2C, Watchdog Timer Interface: 10/100/1000 GbE connection Note: Build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with build options will need to be created and may cause production lead times.Specifications Mechanical and Environmental I/O Interfaces USB: 1x USB 3.0 (USB 0) 3x USB 2.0 (USB 1,2,3) and 1x USB 2.0 client (USB 7) Form Factor: PICMG COM.0: Rev 2.1 Type 10 Dimension: Mini size: 84 mm x 55 mm SATA: Two SATA 3 Gb/s ports Serial: 2 UART ports COM 0/1 (COM 0 support console redirection) Operating Temperature eMMC: Optional soldered on module bootable eMMC flash storage Standard: 0C to +60C 8G to 32 GB Extreme Rugged: -40 to +85C (build option, Atom E38xx series only) SD: Optional, SD support multiplexed over GPIO pins eMMC and SD functions may vary between OS Humidity GPIO: 4 GPO and 4 GPI 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Super I/O Shock and Vibration On carrier if needed (standard support for W83627DHG-P) IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table Power 214-I, Condition D Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% HALT Wide Input: ATX = 5-14V / 5Vsb (standard temp. only) AT = 5-14V (standard temp. only) Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Management: ACPI 4.0 compliant, Smart Battery support Power States: C0, C1, C1E, C4, C6 S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/S4/S5 ECO mode: Supports deep S5 (ECO mode) for power saving Operating Systems Standard Support Windows 7/8 32/64-bit, Linux 32/64-bit Extended Support (BSP) WES7/8, Linux, VxWorks 32/64-bit, WEC7 32-bit Note: Build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with build options will need to be created and may cause production lead times.