Product Information

THSH-IBR-BTL

THSH-IBR-BTL electronic component of ADLINK Technology

Datasheet
Heat Sinks PASSIVE HEAT SINK FOR Express-IBR

Manufacturer: ADLINK Technology
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 90.4535 ea
Line Total: USD 90.4535

16 - Global Stock
Ships to you between
Thu. 11 Apr to Mon. 15 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
16 - Global Stock


Ships to you between Thu. 11 Apr to Mon. 15 Apr

MOQ : 1
Multiples : 1

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THSH-IBR-BTL
ADLINK Technology

1 : USD 98.1335
10 : USD 92.0115
25 : USD 85.8774
50 : USD 82.7983
100 : USD 79.7313
250 : USD 76.6762
2500 : USD 76.6641

     
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RoHS - XON
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Express-IBR Extreme Rugged COM Express Basic Size Type 6 Module with Intel Core Processor with Intel QM77 Express Chipset Features Intel qual or dual Core i7/i3 Processor with Mobile Intel QM77 Express Chipset Up to 16GB DDR3 with ECC support in two SODIMM sockets at 1600MHz Three Digital Display Interfaces (DDI) for HDMI/DVI/DisplayPort or SDVO Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1) GbE, 2x SATA 6 Gb/s, 2x SATA 3 Gb/s, USB 2.0, 4 USB 3.0 50% Thicker PCB for high vibration environments Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System Video CPU Integrated in Processor Intel Core i7/i3, 22nm process, BGA type Intel HD Graphics 4000 at 650-1300 MHz i7-3615QE 2.3GHz, 6MB L3 cache, 45W, quad core Integrated Video i7-3612QE 2.1GHz, 6MB L3 cache, 35W, quad core i7-3555LE 2.5GHz, 4MB L3 cache, 25W, dual core DirectX 11.0, OpenGL 3.1, and OCL 1.1 i7-3517UE 1.7GHz, 4MB L3 cache, 17W, dual core i3-3217UE 1.6GHz, 3MB L3 cache, 17W, dual core Media Processing Decode (HW JPEG & MJPEG decode), Memory encode (full HW MPEG2 encode), transcode Dual channel ECC 1600 MHz DDR3 memory up to Intel Clear Video HD Technology + enhanced media processing 16 GB in dual SODIMM sockets VGA Interface BIOS Analog VGA support with 300 MHz DAC AMI EFI with CMOS backup in 16 Mb SPI flash Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug Hardware Monitor LVDS Interface Supply voltages and CPU temperature Dual channel 18/24-bit LVDS Debug Interface Digital Display Interface XDP SFF-26 extension for ICE debug Three DDI ports supporting HDMI/DVI/DisplayPort or SDVO Watchdog Timer Audio Programmable timer range to generate RESET Chipset Expansion Busses Integrated in Mobile Intel QM77 Express chipset PCI Express x16 (Gen3) bus for discrete graphics solution or general purpose PCI Express (2 x8 or 1 x8 with 2 x4) Audio Codec 7 PCI Express x1: Lanes 0/1/2/3/4/5/6 Implemented on carrier board LPC bus, SMBus (system), I2C (user) Ethernet Technologies Chipset: Intel Gigabit LAN PHY WG82579LM PAVP 3.0, Intel AMT 8.0, Intel VT, Intel AES-NI, Intel HT, Intel HD Graphics Speed: 10/100/1000 Mbps Ethernet with Dynamic Frequency, Intel Turbo Boost , Dynamic Turbo, Intel AVX 1.0, Intel Quick Sync Video Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. Specifications I/O Interfaces Mechanical and Environmental Chipset Form Factor: PICMG COM.0: Rev 2.1 Type 6 Integrated in Mobile Intel QM77 Express chipset Dimension: Basic size: 125 mm x 95 mm Board Thickness: 0.093 (2.3mm) USB Supports up to eight ports USB 2.0, 4 USB 3.0 Operating Temperature Standard: 0C to +60C SATA Extreme Rugged: -40C to +85C (build option) Two SATA 6 Gb/s, two SATA 3 Gb/s with support for RAID 0,1,5,10 Storage Temperature: -55C to +85C Super I/O Humidity Connected to LPC bus on carrier if needed (BIOS supports W83627DHG) 90% at +60C non-condensing Shock TPM 50G peak-to-peak, 11ms duration, MIL-STD-202G Method 213B Chipset: Atmel AT97SC3204-U1A190 Type: TPM 1.2 Vibration Operating: 11.96 Grms, 50-20,000 Hz, each axis, MIL-STD-202G Method 214A Power Certifications: CE, FCC, HALT Input Power: AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) Power States: Supports S0, S1, S3, S4, S5 Operating Systems Power Consumption: 12W typical (i7-36xxQE) Standard Support 8W typical (i7-3555LE/i7-3517UE/i3-3217UE) Windows 7, Linux S3: 0.85W Extended Support (BSP) S5: 0.55W Windows XPe/7, WEC 7, Linux, VxWorks 6.9, QNX 6.5, AIDI Library Smart Battery Support: Yes (BIOS supports LTC4100 and LTC1760) Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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