ATS-PCB1054 Advanced Thermal Solutions

ATS-PCB1054 electronic component of Advanced Thermal Solutions
ATS-PCB1054 Advanced Thermal Solutions
ATS-PCB1054 Heat Sinks
ATS-PCB1054  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of ATS-PCB1054 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ATS-PCB1054 Heat Sinks are a product manufactured by Advanced Thermal Solutions. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. ATS-PCB1054
Manufacturer: Advanced Thermal Solutions
Category: Heat Sinks
Description: Heat Sinks BGA Heat Sink, Board Level Stamped, No TIM, Tin Plate, TO220, 60x25x8.5mm LxWxH
Datasheet:
Price (USD)
1: USD 2.4696 ea
Line Total: USD 2.47 
Availability : 306
  
Ship by Wed. 19 Nov to Fri. 21 Nov
QtyUnit Price
1$ 2.4696
10$ 2.352
50$ 2.3226

Availability 306
Ship by Wed. 19 Nov to Fri. 21 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 2.4696
10$ 2.352
50$ 2.3226

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the ATS-PCB1054 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATS-PCB1054 and other electronic components in the Heat Sinks category and beyond.

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, Inc.The ATS-PCB1054 with Heat Sinks BGA Heat Sink, Board Level Stamped, No TIM is an advanced thermal management solution manufactured by Advanced Thermal Solutions, Inc. This heat sink is designed to fit on most TO220-style packages up to 60x25x8.5mm in size. It is crafted from high-quality, corrosion-resistant tin-plated copper and features stamped board-level mounting for direct-pitch soldering. It can help reduce temperatures up to 10C and does not require a temperature-controlled environment. This part can help increase the efficiency of electronics while significantly reducing risk of operational failure.

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