ATS-UC-NF-200 Advanced Thermal Solutions

ATS-UC-NF-200 electronic component of Advanced Thermal Solutions
ATS-UC-NF-200 Advanced Thermal Solutions
ATS-UC-NF-200 Heat Sinks
ATS-UC-NF-200  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of ATS-UC-NF-200 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ATS-UC-NF-200 Heat Sinks are a product manufactured by Advanced Thermal Solutions. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. ATS-UC-NF-200
Manufacturer: Advanced Thermal Solutions
Category: Heat Sinks
Description: Heat Sink Intel LGA2011 & LGA2066 CPU Cooler Copper Top Mount, Skived
Datasheet: ATS-UC-NF-200 Datasheet (PDF)
Price (USD)
100: USD 136.8511 ea
Line Total: USD 13685.11 
Availability : 0
  
QtyUnit Price
100$ 136.8511
250$ 136.7412
500$ 136.7412
1000$ 136.7412
2500$ 136.7412

Availability 0
Ship by Fri. 03 Oct to Thu. 09 Oct
MOQ : 100
Multiples : 1
QtyUnit Price
100$ 193.4887
500$ 188.3437
1000$ 183.0281
2500$ 137.3269
5000$ 129.4781
10000$ 123.1256


Availability 0
Ship by Fri. 03 Oct to Thu. 09 Oct
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 206.2608
10$ 185.6246
25$ 173.2497
50$ 167.0621


Availability 0
Ship by Wed. 01 Oct to Fri. 03 Oct
MOQ : 100
Multiples : 100
QtyUnit Price
100$ 136.8511
250$ 136.7412
500$ 136.7412
1000$ 136.7412
2500$ 136.7412


Availability 0
Ship by Fri. 03 Oct to Thu. 09 Oct
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 153.3892
10$ 144.3086
25$ 144.3086

   
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RoHS - XON
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We are delighted to provide the ATS-UC-NF-200 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATS-UC-NF-200 and other electronic components in the Heat Sinks category and beyond.

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High-Performance Passive Coolers Description: Designed for CPUs and other high- powered processors that fit the Intel LGA2011 square and LGA2066 sockets (Socket R) Heat Sink Type: straightFIN Heat Sink Features & Benefits Provided with Chomerics T670 thermal grease Mechanical attachment is PEM, screws and spring For other types of attachments contact ATS Installed hardware provides up to 9.2 PSI pressure To apply these heat sinks to other high-powered processors, such as FPGAs, CPUs, AI processors, or GPUs, contact ATS *Image is for illustration purposes only. Optional ATS-HK379-R0 PCB back- plate (left) available for applications other than socket LGA-2011. Attaches beneath PCB, as pictured above. Product Details Dimen- Dimen- Dimen- Dimen- Weight incl. Part Number Material sion A sion B sion C sion D hardware Finish Application Notes (mm) (mm) (mm) (mm) (grams) Ideal for 1U systems with open airflow front to back, Al 90 90 28 80 190 Blue Anodized ATS-UC-NF-100 aluminum fins reduce weight Ideal for 1U systems with open airflow front to back, ATS-UC-NF-101 Al 90 90 28 80 242 Blue Anodized aluminum fins reduce weight Ideal for 1U systems with open airflow front to back, copper fins Cu 90 90 28 80 728 Nickel-Plated ATS-UC-NF-200 reduce spreading resistance Ideal for 1U systems with open airflow front to back, copper fins ATS-UC-NF-201 Cu 90 90 28 80 808 Nickel-Plated reduce spreading resistance NOTES: Thermal Data* 1. Thermal performance data are provided for reference only. Actual perfor- mance may vary by application. 2. Thermal resistance data are for 40 x 40mm component. R R R R R Part Number ( 1 m/s) ( 2 m/s) ( 3 m/s) ( 4 m/s) ( 6 m/s) 3. Dimension A: Base Length 4. Dimension B: Heat Sink Width 5. Dimension C: Heat Sink Height ATS-UC-NF-100 0.74 0.42 0.33 0.29 N/A 6. Dimension D: Center of attachment to the next center of attachment 7. A TS reserves the right to update or change 0.79 0.42 0.31 0.25 N/A ATS-UC-NF-101 its products without notice to improve the design or performance 8. RoHS-6 and REACH compliant ATS-UC-NF-200 0.57 0.29 0.21 0.16 0.13 9. Contact ATS at ats-hq qats.com 0.69 0.34 0.34 0.17 0.12 ATS-UC-NF-201 *Shaded boxes represent air velocity that each heat sink is optimized for. Test conditions: heat sinks tested in duct with 30x150 mm cross-section to mimic use in 1-U chassis. Heat source size: 40x40 mm. For further technical information, please contact Advanced Thermal Solutions, Inc. R4 0319 89-27 ACCESS ROAD, NORWOOD, MA 02062 USA T: 781.769. 2800 ATS-HQ QATS.COM WWW.QATS.COM X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for Heat Sinks category: Click to view products by Advanced Thermal Solutions manufacturer: Other Similar products are found below : 581102B00000G 656-15ABPE 657-20ABPNE 7020B-TC12-MTG 73452PPBA 7G0011A PF720G A22-4026 120-1873-007 HAH10L HAH15L 1542616-1 HS-2506-F1 HS-87M0-F2 218-40CTE3 231-69PAB-15V 25-7520 SW50-4G 231-75PAB-13V 231-75PAB-15V 253- 122ABE-22 PSC22CB HAF10L HAQ10T D10100-28 BDN183CBA01 3-21053-4 32438 TX0506-1B TX1806B LAE66A3CB WA-DT2- 101E 511-3U 73381PPBA 73403PPBA 7G0047C COMX-440-HSP 510-12M D10650-40T5 V8511 Y APF40-40-13CB/A01 780653U04500G ATS-54310K-C2-R0 FK 216 CB SA FK 231 SA 220 648-51AB 657-20ABPESC 2341BG 679-25AG FK 212 CB SA

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7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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