X-On Electronics has gained recognition as a prominent supplier of ATS-X53230B-C1-R0 heat sinks across the USA, India, Europe, Australia, and various other global locations. ATS-X53230B-C1-R0 heat sinks are a product manufactured by Advanced Thermal Solutions. We provide cost-effective solutions for heat sinks, ensuring timely deliveries around the world.

ATS-X53230B-C1-R0 Advanced Thermal Solutions

ATS-X53230B-C1-R0 electronic component of Advanced Thermal Solutions
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Part No.ATS-X53230B-C1-R0
Manufacturer: Advanced Thermal Solutions
Category:Heat Sinks
Description: Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 23x23x7.5mm
Datasheet: ATS-X53230B-C1-R0 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 21.5208 ea
Line Total: USD 21.52

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 03 Jun to Fri. 07 Jun

MOQ : 1
Multiples : 1
1 : USD 19.4003
3 : USD 18.3409

     
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Thermal Resistance @200 Lfm
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We are delighted to provide the ATS-X53230B-C1-R0 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATS-X53230B-C1-R0 and other electronic components in the Heat Sinks category and beyond.

The ATS-X53230B-C1-R0 is a 23x23x7.5mm BGA cooling solution from Advanced Thermal Solutions. It features superGRIP attachment for mounting on dense electronic components, a high-performance design, two fins which dissipate heat, and a low-profile design. The heat sinks are designed to accommodate BGA and other dense packaging designs. It is designed with a combination of thermal resistance, high airflow capacity, and low air flow restriction in order to reduce temperatures and prevent thermal hot spots, ensuring the reliable operation of sensitive electronics. The heat sinks can also be mounted on circuit boards with low-standoff components.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Advanced Thermal Solutions Inc.
Advanced Thermal Solutions, Inc

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