ATS-X53270P-C1-R0 Advanced Thermal Solutions

ATS-X53270P-C1-R0 electronic component of Advanced Thermal Solutions
ATS-X53270P-C1-R0 Advanced Thermal Solutions
ATS-X53270P-C1-R0 Heat Sinks
ATS-X53270P-C1-R0  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of ATS-X53270P-C1-R0 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ATS-X53270P-C1-R0 Heat Sinks are a product manufactured by Advanced Thermal Solutions. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. ATS-X53270P-C1-R0
Manufacturer: Advanced Thermal Solutions
Category: Heat Sinks
Description: Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 27x27x17.5mm
Datasheet: ATS-X53270P-C1-R0 Datasheet (PDF)
Price (USD)
1: USD 24.108 ea
Line Total: USD 24.11 
Availability : 17
  
Ship by Mon. 24 Nov to Wed. 26 Nov
QtyUnit Price
1$ 24.108
3$ 23.4465
5$ 22.932
10$ 22.5498

Availability 17
Ship by Mon. 24 Nov to Wed. 26 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 24.108
3$ 23.4465
5$ 22.932
10$ 22.5498

   
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RoHS - XON
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the ATS-X53270P-C1-R0 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATS-X53270P-C1-R0 and other electronic components in the Heat Sinks category and beyond.

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IncThe Advanced Thermal Solutions Inc ATS-X53270P-C1-R0 is a high performance BGA cooling solution with superGRIP attachment. It measures 27x27x17.5 mm and includes high quality heat sinks with excellent heat dissipation. The device is constructed with aluminum material and comes with superGRIP legs and high-strength adhesive for secure attachment. It can be used for various electronic cooling applications such as ASICs and GPUs. The product also boasts excellent heat transfer performance, ensuring clean thermal management.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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