T25112 Allied Controls

Features Concave terminals RoHS compliant* 8 bit multiple applications Smallest bussed chip array E 24 Series from 10 ohms to 1 megohm CAT25 - Thick Film Chip Resistor Arrays Electrical Characteristics How To Order CA T 25 - 103 J A LF Parameters CAT25 Test Method Product Number of Resistors 8 CA = Chip Array Resistance Range E24 10 ohms to 1 megohm Pin Style Resistance Tolerance 5 % JIS-C-5202.5.1 T = Concave Power Rating/Resistor 62.5 mW Model Rating Temperature +70 C Resistance Value 103 = 10K ohms T.C.R. 200 ppm/C JIS-C-5202.5.2 Tolerance Maximum Operating Voltage 25 V J = 5 % Operating Temperature -55 C to +125 C Electrical Circuit A = 8 Resistors, Bussed Type Environmental Characteristics Terminations LF = Tin-plated (RoHS compliant) Speci cation Characteristics Test Method Short Time Overload (3 % +0.1 ohm) JIS-C-5202.5.5 Load Life (5 % +0.1 ohm) JIS-C-5202.7.10 For Standard Values Used in Capacitors, Inductors, and Resistors, Humidity Load Life (3 % +0.1 ohm) JIS-C-5202.7.9 click here. Resistance to Soldering Heat (1 % +0.1 ohm) JIS-C-5202.6.4 Terminal Strength (1 % +0.1 ohm) JIS-C-5202.6. Temperature Cycle (2 % +0.1 ohm) JIS-C-5202.7.4 Vibration (1 % +0.1 ohm) JIS-C-5202.6.3 Insulation Resistance 1000 megohms minimum JIS-C-5202.5.6 Dielectric Withstanding Voltage 50 VRMS JIS-C-5202.5.7 Lead Solderability >95 % JIS-C-5202.6.5 Outline Drawing Land Pattern 4.8 - 5.2 (.190 - .205) 2.10 0.20 (.083 .008) 2.8 - 3.0 0.9 - 1.1 (.110 - .118) 0.25 0.20 (.035 - .043) (.010 .008) 3.2 - 3.5 (.125 - .138) 3.3 - 3.4 0.30 0.20 (.130 - .133) (.012 .008) 0.55 0.10 (.022 .004) 0.80 0.10 (.032 .004) MM 4.00 0.20 DIMENSIONS: (INCHES) (.157 .008) 0.4 - 0.5 0.80 (.016 - .020) (.032) 0.35 0.20 0.50 0.20 (.014 .008) (.020 .008) Electrical Circuit DIA. 0.30 +0.10/-0.20 (.012 +.004/-.008) 0.40 0.20 (.016 .008) *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. Speci cations are subject to change without notice. Customers should verify actual device performance in their speci c applications *RoHS COMPLIANT CAT25 - Thick Film Chip Resistor Arrays Soldering Pro le for RoHS Compliant Chip Resistors and Arrays 275 <1> Maximum of 20 seconds between 260 C peak +255 C and +260 C <1> 255 C 225 220 C 190 C 60 - 90 seconds 175 150 C Ramp Down 6 C/second 125 60 - 120 seconds 10 seconds minimum 75 Ramp Up 3 C/second maximum 25 0 50 100 150 200 250 300 Time (seconds) Packaging Material 12 Substrate Alumina 96 (.472) embossed tape Element Ruthenium Oxide 4,000 pcs. per reel Coating Glass Terminal Plated Ni+Sn REV. 06/11 Speci cations are subject to change without notice. Customers should verify actual device performance in their speci c applications Temperature (C)