INVENTEC 500 Main Street, Suite 18 PO Box 989 Deep River, CT 06417 USA Toll Free: 800.435.0317 Phone: 860.526.8300 Fax: 860.526.8243 NC-31, No-Clean Solder Paste www.amtechsolder.com Product Data Sheet Available Alloys Product Highlights Alloy Temp C Temp F n ROL0 flux classification 42Sn/58Bi 138 280 n Designed for low temperature applications 42Sn/57Bi/1Ag 138 280 n Exceptional print definition 43Sn/43Pb/14Bi 144-163 291-325 n Excellent wetting on all common finishes including Ni/Au n REACH compliant Packaging n Print & Dispense grade solder paste available. 500 gram jars 500 gram cartridges 35 or 100 gram syringes ProFlow cassettes Test Results Test J-STD-004 or Test Requirement Result other requirements (as stated) Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5% Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (no-clean) o Surface Insulation Resistance 85 C, IPC-TM-650: 2.6.3.7 L: 100 M (no-clean) 85% RH 168 Hours Tack Value IPC-TM-650: 2.4.44 48g o Viscosity - Malcom 10 RPM/25 C IPC-TM-650: 2.4.34.4 Print: 125-180 3 (x10 mPa/s)- 42Sn/58Bi T3/T4 Dispensing: 90-130 Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Coalition (EICC) Compliant REACH Compliance Articles 33 and 67 of Regulation Contains no substance (EC) No 1907/2006 >0.1% w/w that is listed as a SVHC or restricted for use in solder materialsNC-31, No-Clean Solder Paste Printer Operation Amtech Low Oxide Powder Distribution The following are general guidelines for stencil Micron Size Type Pitch Requirements printer optimization with NC-31. Some adjustments 45-75 Type-2 24 mil and above may be necessary based on your process 25-45 Type-3 16-24 mil requirements. 20-38 Type-4 12-16 mil 15-25 Type-5 8-12 mil Print Speed: 25-125 mm/sec 5-15 Type-6 5-8 mil Squeegee Pressure: 70-250g/cm of blade 2-11 Type-7 < 5 mil Under Stencil Wipe: Once every 10-25 prints, Note: Type-6 and Type-7 may not be available in certain alloys. Other powder distributions are available on request. or as necessary Storage Stencil Life o o Solder paste should be stored between 3-8 C > 12 hours 30-45% RH and 20-25 C o o (37-46 F) to obtain the maximum refrigerated shelf ~ 4 hours 45-75% RH and 20-25 C life of six months. Unopened solder paste stored o o at room temperature, 25 C (77 F) will have a one Cleaning month shelf life. Syringes and cartridges should NC-31 is a no-clean solder paste that does not be stored vertically in the refrigerator with the require cleaning for most SMT assemblies. For dispensing tip down. Allow 4-8 hours for solder applications requiring cleaning, NC-31 can be o paste to reach an operating temperature of 20-25 C cleaned using flux residue removers such as o (68-77 F). Keep the solder paste container sealed Inventec Disper 607 and Disper 610. while warming the solder paste to operating temperature. NEVER FREEZE SOLDER PASTE. Sn42 Bi58 Recommended Profile 180 Peak Temp Min 158 C Max 165 C (Sn42/Bi58) This profile is designed to serve 160 as a starting point for process Liquidus Temperature for Sn42/Bi58 alloy 138 C optimization using NC-31. 140 To achieve better results with 120 voiding or to reduce tombstoning, Reflow Time= 60 Sec 100 consider using a longer soaking o Soak Temp 90-140 C zone, (90-130 C) for 60-90 80 Soak Time 60-90 Sec seconds, with a rapid pre-heat 60 stage. If there is evidence of solder de-wetting, consider 40 lowering the peak reflow 20 temperature, or reduce the time above liquidus to <60 seconds. 0 0 30 60 90 120 150 180 210 240 270 300 330 360 Time (Sec) Sn42/Bi58 Special Alloy Profile Revised December 9, 2015