Product Information

ADMV7810CHIPS

ADMV7810CHIPS electronic component of Analog Devices

Datasheet
RF Amplifier High Band PA Die

Manufacturer: Analog Devices
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25: USD 215.8691 ea
Line Total: USD 5396.73

0 - Global Stock
MOQ: 25  Multiples: 25
Pack Size: 25
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Ships to you between Thu. 23 May to Mon. 27 May

MOQ : 25
Multiples : 25

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ADMV7810CHIPS
Analog Devices

25 : USD 222.5111

     
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Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Type
Technology
Operating Frequency
P1dB - Compression Point
Gain
Operating Supply Voltage
OIP3 - Third Order Intercept
Minimum Operating Temperature
Maximum Operating Temperature
Operating Supply Current
Packaging
Series
Brand
Number Of Channels
Input Return Loss
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81 GHz to 86 GHz, 1 W E-Band Power Amplifier with Power Detector Data Sheet ADMV7810 FEATURES GENERAL DESCRIPTION Gain: 20 dB typical The ADMV7810 is an integrated E-band gallium arsenide (GaAs), Output power for 1 dB compression: 28 dBm typical pseudomorphic, high electron mobility transfer (pHEMT), mono- Saturated output power: 29 dBm typical lithic microwave integrated circuit (MMIC), medium power Output third-order intercept: 33 dBm typical amplifier with a temperature compensated on-chip power detector Input return loss: 12 dB typical that operates from 81 GHz to 86 GHz. The ADMV7810 provides Output return loss: 20 dB typical 20 dB of gain, 28 dBm of output power at 1 dB compression, and DC supply: 4 V at 800 mA 29 dBm of saturated output power at 18% power added efficiency No external matching required from a 4 V power supply. The ADMV7810 exhibits excellent Die size: 2.999 mm 3.799 mm 0.05 mm linearity and is optimized for E-band communications and high capacity wireless backhaul radio systems. The amplifier APPLICATIONS configuration and high gain make the device an excellent E-band communication systems candidate for last stage signal amplification before the antenna. High capacity wireless backhaul radio systems All data is taken with the chip in a 50 test fixture connected via Test and measurement a 3 mil wide 0.5 mil thick 7 mil long ribbon on each port. The ADMV7810 is available in a 40-pad bare die (CHIP) and operates over the 55C to +85C temperature range. FUNCTIONAL BLOCK DIAGRAM 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 ADM V7 8 1 0 20 RF O UT 21 22 3 RF I N 2 1 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 Figure 1. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20182019 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. VGG1A VGG1B VDD1B VDD1A VG G 2A VGG2B VDD2B VDD2A VG G 3B VGG3A VDD3B VDD3A VG G 4B VG G 4A VDD4A VDD4B VDET VREF 16409-001ADMV7810 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Theory of Operation ...................................................................... 14 Applications ....................................................................................... 1 Applications Information .............................................................. 15 General Description ......................................................................... 1 Assembly Diagram ..................................................................... 16 Functional Block Diagram .............................................................. 1 Mounting and Bonding Techniques for Millimeterwave GaAs MMICs ............................................................................................. 17 Revision History ............................................................................... 2 Handling Precautions ................................................................ 17 Specifications ..................................................................................... 3 Mounting ..................................................................................... 17 Absolute Maximum Ratings ............................................................ 4 Wire Bonding .............................................................................. 17 Thermal Resistance ...................................................................... 4 Outline Dimensions ....................................................................... 18 ESD Caution .................................................................................. 4 Ordering Guide .......................................................................... 18 Pin Configuration and Function Descriptions ............................. 5 Interface Schematics..................................................................... 6 Typical Performance Characteristics ............................................. 7 REVISION HISTORY 3/2019Rev. 0 to Rev. A Changes to Figure 1 .......................................................................... 1 Changes to Figure 2 .......................................................................... 5 Added Figure 45 Renumbered Sequentially .............................. 13 Changes to Figure 47 ...................................................................... 15 Changes to Figure 48 ...................................................................... 16 Changes to Ordering Guide .......................................................... 18 3/2018Revision 0: Initial Version Rev. A Page 2 of 18

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AD4
ANALOG DEVICES
Analog Devices Hittite
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Analog Devices / Hittite
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